Texas Instruments TMS320DM368ZCEF

TMS320DM368ZCEF Texas Instruments
Texas Instruments

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Clock Rate:
432MHz
Supplier Device Package:
338-BGA (13x13)
Operating Temperature:
0°C ~ 85°C (TC)
Package / Case:
338-LFBGA
Voltage - Core:
1.35V
Type:
Digital Media System-on-Chip (DMSoC)
REACH Status:
REACH Unaffected
edacadModel:
TMS320DM368ZCEF Models
edacadModelUrl:
/en/models/2353694
Manufacturer:
Texas Instruments
On-Chip RAM:
56kB
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Interface:
EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB
standardLeadTime:
18 Weeks
Mounting Type:
Surface Mount
Series:
TMS320DM3x, DaVinci™
Voltage - I/O:
1.8V, 3.3V
Packaging:
Tray
Non-Volatile Memory:
ROM (16kB)
Base Product Number:
TMS320
ECCN:
3A991A2
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This is manufactured by Texas Instruments. The manufacturer part number is TMS320DM368ZCEF. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has a clock rate of 432mhz. 338-bga (13x13) is the supplier device package value. The product has 0°c ~ 85°c (tc) operating temperature range. Moreover, the product comes in 338-lfbga. Its core voltage is [Voltage -Core]. It comes in digital media system-on-chip (dmsoc) configuration. In addition, it is reach unaffected. The texas instruments's product offers user-desired applications. The on-chip RAM includes 56kb. Its typical moisture sensitivity level is 3 (168 hours). A bespoke product is ebi/emi, ethernet, i2c, mcbsp, spi, uart, usb interface. It has a long 18 weeks standard lead time. The product is available in surface mount configuration. The product tms320dm3x, davinci™, is a highly preferred choice for users. It has a typical 1.8v, 3.3v I/O voltage. In addition, tray is the available packaging type of the product. It bears rom (16kb) of non-volatile memory. Moreover, it corresponds to tms320, a base product number of the product. The product is designated with the 3a991a2 code number.

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Multiple Parts 28/Jul/2022(PCN Assembly/Origin)
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Copper Bond Wire Update 21/Sep/2015(PCN Design/Specification)
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Mult Dev 13/Apr/2020(PCN Packaging)
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Mult Dev Rev 27/Apr/2020(PCN Packaging)

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