Maximum Diode Capacitance:
2.5pF
Dimensions:
3.04 x 1.4 x 1.01mm
Mounting Type:
Surface Mount
Power Dissipation:
300mW
Maximum Forward Current:
200mA
Height:
1.01mm
Width:
1.4mm
Length:
3.04mm
Package Type:
SOT-23
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Reverse Voltage:
70V
Maximum Operating Temperature:
+150 °C
Diode Configuration:
Single
Pin Count:
3
Reverse Recovery Time (trr):
4 ns
HTSUS:
8541.10.0070
RoHS Status:
ROHS3 Compliant
Package / Case:
TO-236-3, SC-59, SOT-23-3
Operating Temperature - Junction:
-55°C ~ 150°C
REACH Status:
REACH Unaffected
edacadModel:
MMBD6050LT1G Models
edacadModelUrl:
/en/models/919571
Current - Average Rectified (Io):
200mA
Speed:
Small Signal =< 200mA (Io), Any Speed
Voltage - Forward (Vf) (Max) @ If:
1.1 V @ 100 mA
Voltage - DC Reverse (Vr) (Max):
70 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
6 Weeks
Current - Reverse Leakage @ Vr:
100 nA @ 50 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
SOT-23-3 (TO-236)
Packaging:
Tape & Reel (TR)
Technology:
Standard
Base Product Number:
MMBD6050
ECCN:
EAR99
