Vishay General Semiconductor - Diodes Division SL03-GS08

SL03-GS08 Vishay General Semiconductor - Diodes Division
SL03-GS08
Vishay General Semiconductor - Diodes Division

Product Information

HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Package / Case:
DO-219AB
Operating Temperature - Junction:
125°C (Max)
title:
SL03-GS08
REACH Status:
REACH Unaffected
edacadModel:
SL03-GS08 Models
edacadModelUrl:
/en/models/2345108
Current - Average Rectified (Io):
1.1A
Speed:
Fast Recovery =< 500ns, > 200mA (Io)
Voltage - Forward (Vf) (Max) @ If:
430 mV @ 1.1 A
Voltage - DC Reverse (Vr) (Max):
30 V
Capacitance @ Vr, F:
-
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
16 Weeks
Current - Reverse Leakage @ Vr:
130 µA @ 30 V
Mounting Type:
Surface Mount
Series:
eSMP®
Supplier Device Package:
DO-219AB (SMF)
Packaging:
Tape & Reel (TR)
Technology:
Schottky
Base Product Number:
SL03
ECCN:
EAR99
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This is manufactured by Vishay General Semiconductor - Diodes Division. The manufacturer part number is SL03-GS08. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in do-219ab. The product operate at temperatures ranging from 125°c (max). In addition, it is reach unaffected. It features a 1.1a of average rectified current. It has a robust speed of fast recovery =< 500ns, > 200ma (io). The product has a maximum forward voltage of 430 mv @ 1.1 a. While it has maximum reverse voltage of 30 v. Its typical moisture sensitivity level is 1 (unlimited). It has a long 16 weeks standard lead time. 130 µa @ 30 v is the reverse leakage value of a bespoke product. The product is available in surface mount configuration. The product esmp®, is a highly preferred choice for users. do-219ab (smf) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. This product use schottky technology. Moreover, it corresponds to sl03, a base product number of the product. The product is designated with the ear99 code number.

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Mult Dev Plating House Add 15/Jan/2021(PCN Assembly/Origin)
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Mult DEV Mult Changes 25/Sep2024(PCN Design/Specification)
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SL02,03(Datasheets)

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