Dual N/P-Channel-Channel MOSFET, 220 mA, 410 mA, 25 V, 6-Pin SOT-363 (SC-70) onsemi FDG6322C

FDG6322C Dual N/P-Channel-Channel MOSFET, 220 mA, 410 mA, 25 V, 6-Pin SOT-363 (SC-70) onsemi
FDG6322C
FDG6322C
onsemi

Product Information

Maximum Drain Source Voltage:
25 V
Typical Gate Charge @ Vgs:
0.29 nC @ 4.5 V, 1.1 nC @ 5 V
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
300 mW
Maximum Gate Source Voltage:
-8 V, +8 V
Height:
1mm
Width:
1.25mm
Length:
2mm
Minimum Gate Threshold Voltage:
0.65V
Package Type:
SOT-363
Number of Elements per Chip:
2
Minimum Operating Temperature:
-55 °C
Maximum Continuous Drain Current:
220 mA, 410 mA
Transistor Material:
Si
Maximum Drain Source Resistance:
1.9 Ω, 7 Ω
Channel Type:
N, P
Maximum Operating Temperature:
+150 °C
Pin Count:
6
Transistor Configuration:
Isolated
FET Feature:
Logic Level Gate
HTSUS:
8541.21.0095
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
6-TSSOP, SC-88, SOT-363
Rds On (Max) @ Id, Vgs:
4Ohm @ 220mA, 4.5V
Gate Charge (Qg) (Max) @ Vgs:
0.4nC @ 4.5V
Vgs(th) (Max) @ Id:
1.5V @ 250µA
REACH Status:
REACH Unaffected
Current - Continuous Drain (Id) @ 25°C:
220mA, 410mA
Configuration:
N and P-Channel
Manufacturer:
onsemi
Drain to Source Voltage (Vdss):
25V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
standardLeadTime:
16 Weeks
Input Capacitance (Ciss) (Max) @ Vds:
9.5pF @ 10V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
SC-88 (SC-70-6)
Packaging:
Tape & Reel (TR)
Power - Max:
300mW
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FDG6322
ECCN:
EAR99
RoHs Compliant
Checking for live stock

This is Dual N/P-Channel-Channel MOSFET 220 mA 410 mA 25 V 6-Pin SOT-363 (SC-70) manufactured by onsemi. The manufacturer part number is FDG6322C. It has a maximum of 25 v drain source voltage. With a typical gate charge at Vgs includes 0.29 nc @ 4.5 v, 1.1 nc @ 5 v. The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 300 mw maximum power dissipation. It features a maximum gate source voltage of -8 v, +8 v. In addition, the height is 1mm. Furthermore, the product is 1.25mm wide. Its accurate length is 2mm. Whereas its minimum gate threshold voltage includes 0.65v. The package is a sort of sot-363. It consists of 2 elements per chip. Whereas, the minimum operating temperature of the product is -55 °c. While 220 ma, 410 ma of maximum continuous drain current. The transistor is manufactured from highly durable si material. It provides up to 1.9 ω, 7 ω maximum drain source resistance. The product is available in [Cannel Type] channel. It has a maximum operating temperature of +150 °c. It contains 6 pins. The product offers isolated transistor configuration. The FET features of the product include logic level gate. It is assigned with possible HTSUS value of 8541.21.0095. The product is rohs3 compliant. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 6-tssop, sc-88, sot-363. It has a maximum Rds On and voltage of 4ohm @ 220ma, 4.5v. The maximum gate charge and given voltages include 0.4nc @ 4.5v. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. In addition, it is reach unaffected. The continuous current drain at 25°C is 220ma, 410ma. The product is available in n and p-channel configuration. The onsemi's product offers user-desired applications. The product has a 25v drain to source voltage. Its typical moisture sensitivity level is 1 (unlimited). It has a long 16 weeks standard lead time. The product's input capacitance at maximum includes 9.5pf @ 10v. sc-88 (sc-70-6) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The maximum power of the product is 300mw. This product use mosfet (metal oxide) technology. Moreover, it corresponds to fdg6322, a base product number of the product. The product is designated with the ear99 code number.

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MOSFET N/P Channel 25V 6 Pin SC70(Technical Reference)
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Mult Dev Assembly 10/Jun/2024(PCN Assembly/Origin)
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FDG6322C(Datasheets)
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onsemi RoHS(Environmental Information)
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2N7002x/BSSx/FDGx/FDVx/NDS06x 10/May/2022(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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