Maximum Drain Source Voltage:
20 V
Typical Gate Charge @ Vgs:
1.1 nC @ 4.5 V, 1.4 nC @ 4.5 V
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
300 mW
Maximum Gate Source Voltage:
-12 V, +12 V
Height:
1mm
Width:
1.25mm
Length:
2mm
Minimum Gate Threshold Voltage:
0.3V
Package Type:
SOT-363
Number of Elements per Chip:
2
Minimum Operating Temperature:
-55 °C
Maximum Continuous Drain Current:
600 mA, 700 mA
Transistor Material:
Si
Maximum Drain Source Resistance:
442 mΩ, 700 mΩ
Channel Type:
N, P
Maximum Operating Temperature:
+150 °C
Pin Count:
6
Transistor Configuration:
Isolated
FET Feature:
Logic Level Gate
HTSUS:
8541.21.0095
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
6-TSSOP, SC-88, SOT-363
Rds On (Max) @ Id, Vgs:
300mOhm @ 700mA, 4.5V
Gate Charge (Qg) (Max) @ Vgs:
1.5nC @ 4.5V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
edacadModel:
FDG6332C Models
Current - Continuous Drain (Id) @ 25°C:
700mA, 600mA
edacadModelUrl:
/en/models/978282
Configuration:
N and P-Channel
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
20V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Input Capacitance (Ciss) (Max) @ Vds:
113pF @ 10V
standardLeadTime:
33 Weeks
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
SC-88 (SC-70-6)
Power - Max:
300mW
Technology:
MOSFET (Metal Oxide)
Base Product Number:
FDG6332
ECCN:
EAR99
