Diameter:
32.5 mm
Finish:
Black Anodised
Thermal Resistance:
5.6°C/W
Material:
Aluminium
Height:
20mm
Application:
PLCC, Power PC, PGA, Bga, Microprocessor, Fan, Heat Sink For IC, Cooler, Ic Processors, SMD
Standards/Approvals:
No
Compatible Package Type:
LED, PGA, PLCC, BGA, SMD, IC, DIL/IC, Chip, Slot
For Use With:
Universal Round Alu
Fastening:
Clamp, Conductive Adhesive, Glue, Integrated clamp, Screw, Thermally conductive adhesive
Special Features:
Compact Design With High Mechanical Stability, Customer Specific Modifications and Special Designs, Excellent Thermal Efficiency, Other Operating Voltages on Request, High Mechanical Stability, Effective Heat Dissipation, Fan Motors With Pulse Output and Alarm Device Circuit, Flow-favourable Omnidirectional Fin Geometry, Other Pin Lengths and Surfaces on Request, Components Fastened Using Glue Adhesive Foil or Clamps, High-grade Industrial Type, Particularly Suited for Ball Grid Arrays, Low Current Consumption, Can Be Glued Directly on BGA Component, Low Weight by Optimised Geometry, Heat Sink Dimensions Match Respective BGA Type, Fan Motor Axle With Double Ball Bearings
Product Type:
Heatsink
