Diameter:
28.5 mm
Finish:
Black Anodised
Colour:
Black
Material:
Aluminium Alloy, Thermally Conductive Glue, Thermally Conductive Foil
Height:
18.5mm
Application:
Heat Sink For Pentium II Mobile Module, Heat Sink For IC, Heat Sink For Power PC, Heat Sink For Microprocessor, Heat Sink For Pentium III/Xeon, Heat Sink For Dil and Ic, Heat Sink For PLCC, Heat Sink For Bga, Heat Sink For Pentium Pro, Fan, SMD, Cooler, Heatsink for PGA
Standards/Approvals:
No
Compatible Package Type:
PLCC, DIL/IC, PGA, BGA, LED, SMD
For Use With:
Universal Round Alu
Fastening:
Clamp, Glue, Integrated clamp, Screw
Special Features:
Excellent Thermal Efficiency by Flow-Favourable Omnidirectional Fin Geometry and Black Anodised Surface, or Thermally Conductive Glue, Easy Mounting Using Fixing Clamp, Thermally Conductive Adhesive Foil, Fan Motors With Other Operating Voltages on Request, Compact Design With High Mechanical Stability, Special High-Grade Industrial Type, Components Fastened Using Glue, Custom-specific Modifications and Special Designs, or Clamps, Double Ball Bearings in Fan Motor Axle for High Reliability and Long Product Life, Low Weight by Optimised Geometry, Low Current Consumption and Thus Low Self-Heating, Other Pin Lengths and Surfaces on Request, Effective Heat Dissipation by Optimum Design of Fan Motor and Heatsink, Adhesive Foil, Fan Motors Also Available With Pulse Output and Alarm Device Circuit
Product Type:
Heatsink
Thermal Resistance:
4.25°C/W
