AMD XC7K325T-2FBG676C

XC7K325T-2FBG676C AMD
AMD

Product Information

HTSUS:
8542.31.0060
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Number of I/O:
400
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
676-BBGA, FCBGA
title:
XC7K325T-2FBG676C
REACH Status:
REACH Unaffected
Total RAM Bits:
16404480
Number of Logic Elements/Cells:
326080
Moisture Sensitivity Level (MSL):
4 (72 Hours)
standardLeadTime:
16 Weeks
Number of LABs/CLBs:
25475
Mounting Type:
Surface Mount
Series:
Kintex®-7
Supplier Device Package:
676-FCBGA (27x27)
Packaging:
Tray
Voltage - Supply:
0.97V ~ 1.03V
Base Product Number:
XC7K325
ECCN:
3A991D
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This is manufactured by AMD. The manufacturer part number is XC7K325T-2FBG676C. It is assigned with possible HTSUS value of 8542.31.0060. The product is rohs3 compliant. 400 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 676-bbga, fcbga. In addition, it is reach unaffected. It include a total of 16404480 RAM bits. The product contains 326080 logic cells/elements. Its typical moisture sensitivity level is 4 (72 hours). It has a long 16 weeks standard lead time. It consists of 25475 CLBs/LABs. The product is available in surface mount configuration. The product kintex®-7, is a highly preferred choice for users. 676-fcbga (27x27) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 0.97v ~ 1.03v. Moreover, it corresponds to xc7k325, a base product number of the product. The product is designated with the 3a991d code number.

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Xilinx REACH211 Cert(Environmental Information)
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Mult Dev Material Chg 16/Dec/2019(PCN Design/Specification)
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All product New AMD Logo 13/May/2024(PCN Design/Specification)
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Mult Devices 26/Jun/2017(PCN Packaging)

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