AMD Xilinx XC7K325T-2FFG900I

Enrgtech Part No: ET22842056
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Manufacturer Part No:
XC7K325T-2FFG900I
|
Manufacturer: AMD Xilinx

Product Information

HTSUS:

8542.39.0001

RoHS Status:

ROHS3 Compliant

Number of I/O:

500

Operating Temperature:

-40°C ~ 100°C (TJ)

Package / Case:

900-BBGA, FCBGA

Total RAM Bits:

16404480

Number of Logic Elements/Cells:

326080

REACH Status:

REACH Unaffected

Package:

Tray

Moisture Sensitivity Level (MSL):

4 (72 Hours)

standardLeadTime:

48 Weeks

Number of LABs/CLBs:

25475

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This is manufactured by AMD Xilinx. The manufacturer part number is XC7K325T-2FFG900I. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. 500 is the I/O value of the product. The product has -40°c ~ 100°c (tj) operating temperature range. Moreover, the product comes in 900-bbga, fcbga. It include a total of 16404480 RAM bits. The product contains 326080 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 4 (72 hours). It has a long 48 weeks standard lead time. It consists of 25475 CLBs/LABs. The product is available in surface mount configuration. The product kintex®-7, is a highly preferred choice for users. 900-fcbga (31x31) is the supplier device package value. It has optimum voltage supply of 0.97v ~ 1.03v. Moreover, it corresponds to xc7k325, a base product number of the product. The product is designated with the 3a991d code number.

Xilinx REACH211 Cert(Environmental Information)

Mult Dev Material Chg 16/Dec/2019(PCN Design/Specification)

Product Marking Chg 31/Oct/2016(PCN Design/Specification)

Mult Devices 26/Jun/2017(PCN Packaging)

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AMD Xilinx XC7K325T-2FFG900I

XC7K325T-2FFG900I

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