Intel EPF6024AFC256-3

EPF6024AFC256-3 Intel
Intel

Product Information

HTSUS:
8542.39.0001
Package / Case:
256-BGA
Number of I/O:
219
Operating Temperature:
0°C ~ 85°C (TJ)
DigiKey Programmable:
Not Verified
edacadModel:
EPF6024AFC256-3 Models
Number of Logic Elements/Cells:
1960
REACH Status:
REACH Unaffected
edacadModelUrl:
/en/models/4161716
Package:
Tray
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of LABs/CLBs:
196
Mounting Type:
Surface Mount
Number of Gates:
24000
Series:
FLEX 6000
Supplier Device Package:
256-FBGA (17x17)
Voltage - Supply:
3V ~ 3.6V
Base Product Number:
EPF6024
ECCN:
3A001A2A
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This is manufactured by Intel. The manufacturer part number is EPF6024AFC256-3. It is assigned with possible HTSUS value of 8542.39.0001. Moreover, the product comes in 256-bga. 219 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. The product contains 1960 logic cells/elements. In addition, it is reach unaffected. It is shipped in tray package . Its typical moisture sensitivity level is 3 (168 hours). It consists of 196 CLBs/LABs. The product is available in surface mount configuration. It contains 24000 gates. The product flex 6000, is a highly preferred choice for users. 256-fbga (17x17) is the supplier device package value. It has optimum voltage supply of 3v ~ 3.6v. Moreover, it corresponds to epf6024, a base product number of the product. The product is designated with the 3a001a2a code number.

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Software Disc 06/Nov/2020(PCN Other)
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EOL 01/Dec/2016(PCN Obsolescence/ EOL)
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EOL 21/Nov/2016(PCN Obsolescence/ EOL)
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FLEX 6000 Device Family Data Sheet(Datasheets)
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256-FBGA Pkg Info(Datasheets)
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All Dev Pkg Chg 1/Aug/2018(PCN Packaging)
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Mult Dev Dessicant Chg 19/Jul/2019(PCN Packaging)

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