Lattice Semiconductor Corporation LCMXO2280C-3T144C

LCMXO2280C-3T144C Lattice Semiconductor Corporation
LCMXO2280C-3T144C
Lattice Semiconductor Corporation

Product Information

HTSUS:
8542.31.0060
RoHS Status:
RoHS non-compliant
DigiKey Programmable:
Not Verified
Number of I/O:
113
Operating Temperature:
0°C ~ 85°C (TJ)
Package / Case:
144-LQFP
title:
LCMXO2280C-3T144C
REACH Status:
REACH Unaffected
edacadModel:
LCMXO2280C-3T144C Models
edacadModelUrl:
/en/models/2816517
Number of Logic Elements/Cells:
2280
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Total RAM Bits:
28262
Number of LABs/CLBs:
285
Mounting Type:
Surface Mount
Series:
MachXO
Supplier Device Package:
144-TQFP (20x20)
Packaging:
Tray
Voltage - Supply:
1.71V ~ 3.465V
Base Product Number:
LCMXO2280
ECCN:
EAR99
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This is manufactured by Lattice Semiconductor Corporation. The manufacturer part number is LCMXO2280C-3T144C. It is assigned with possible HTSUS value of 8542.31.0060. The product is rohs non-compliant. 113 is the I/O value of the product. The product has 0°c ~ 85°c (tj) operating temperature range. Moreover, the product comes in 144-lqfp. In addition, it is reach unaffected. The product contains 2280 logic cells/elements. Its typical moisture sensitivity level is 3 (168 hours). It include a total of 28262 RAM bits. It consists of 285 CLBs/LABs. The product is available in surface mount configuration. The product machxo, is a highly preferred choice for users. 144-tqfp (20x20) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 1.71v ~ 3.465v. Moreover, it corresponds to lcmxo2280, a base product number of the product. The product is designated with the ear99 code number.

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Alternate Qualified Test Site 30/Sep/2013(PCN Assembly/Origin)
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Top Mark Format Change 20/Dec/2023(PCN Design/Specification)
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Tin/Lead Devices 23/Jun/2015(PCN Obsolescence/ EOL)
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Product Selector Guide(Datasheets)
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LCMXO_MachXO Family Datasheet(Datasheets)
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All Dev Pkg Mark Chg 12/Nov/2018(PCN Packaging)

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FAQs

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