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NXP USA Inc. OM11031

OM11031 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8471.41.0150
RoHS Status:
Not applicable
Series:
J-Link - IAR
REACH Status:
REACH Unaffected
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Packaging:
Bulk
Base Product Number:
OM11
Manufacturer:
NXP USA Inc.
Type:
Debugger, Programmer (In-Circuit/In-System)
For Use With/Related Products:
ARM7®, ARM9®, ARM11®, Cortex®
Contents:
Board(s)
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is OM11031. It is assigned with possible HTSUS value of 8471.41.0150. The product is not applicable. The product j-link - iar, is a highly preferred choice for users. In addition, it is reach unaffected. Its typical moisture sensitivity level is 1 (unlimited). In addition, bulk is the available packaging type of the product. Moreover, it corresponds to om11, a base product number of the product. The nxp usa inc.'s product offers user-desired applications. It comes in debugger, programmer (in-circuit/in-system) configuration. The product is suitable for use with arm7®, arm9®, arm11®, cortex®. Contents Include: board(s). The product is designated with the ear99 code number.

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OM11031 User Guide(Datasheets)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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FAQs

Yes. You can also search OM11031 on website for other similar products.
We accept all major payment methods for all products including ET17419372. Please check your shopping cart at the time of order.
You can order NXP USA Inc. brand products with OM11031 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in Programmers, Emulators, and Debuggers category are shipped in lowest possible time.
You will get a confirmation email regarding your order of NXP USA Inc. OM11031. You can also check on our website or by contacting our customer support team for further order details on NXP USA Inc. OM11031.
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