NXP USA Inc. LPC55S16JBD100E

LPC55S16JBD100E NXP USA Inc.
LPC55S16JBD100E
NXP USA Inc.

Product Information

HTSUS:
8542.31.0025
RoHS Status:
ROHS3 Compliant
Program Memory Size:
256KB (256K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
100-LQFP Exposed Pad
RAM Size:
96K x 8
Data Converters:
A/D 10x16b SAR
title:
LPC55S16JBD100E
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
EEPROM Size:
-
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
-
Number of I/O:
64
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Grade:
-
Series:
LPC55S1x
Supplier Device Package:
100-HLQFP (14x14)
Packaging:
Tray
Core Processor:
ARM® Cortex®-M33
Speed:
150MHz
Base Product Number:
LPC55S16
ECCN:
5A992C
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC55S16JBD100E. It is assigned with possible HTSUS value of 8542.31.0025. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, rng, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 100-lqfp exposed pad. The product has typical 96k x 8 RAM size. The typical data converters include a/d 10x16b sar. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through can fd, flexcomm, i2c, spi, uart/usart, usb. The product is a external, internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 64 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc55s1x, is a highly preferred choice for users. 100-hlqfp (14x14) is the supplier device package value. In addition, tray is the available packaging type of the product. arm® cortex®-m33 is the product's core processor. It has a robust speed of 150mhz. Moreover, it corresponds to lpc55s16, a base product number of the product. The product is designated with the 5a992c code number.

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Wafer Fab 19/Mar/2023(PCN Assembly/Origin)
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LPC55S1x, LPC551x(Datasheets)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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LPCx/PRH601HLx/PXAH30KFBEx 01/Jun/2022(PCN Packaging)

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