NXP USA Inc. LPC5526JBD64K

LPC5526JBD64K NXP USA Inc.
LPC5526JBD64K
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
256KB (256K x 8)
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Package / Case:
64-TQFP Exposed Pad
RAM Size:
144K x 8
Packaging:
Tray
Program Memory Type:
FLASH
REACH Status:
REACH Unaffected
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
EEPROM Size:
-
Oscillator Type:
External, Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Qualification:
-
Number of I/O:
36
standardLeadTime:
13 Weeks
DigiKey Programmable:
Not Verified
Core Size:
32-Bit Single-Core
Mounting Type:
Surface Mount
Grade:
-
Series:
LPC552x
Supplier Device Package:
64-HTQFP (10x10)
Data Converters:
A/D 10x16b
Core Processor:
ARM® Cortex®-M33
Speed:
150MHz
Base Product Number:
LPC5526
ECCN:
5A992C
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This is manufactured by NXP USA Inc.. The manufacturer part number is LPC5526JBD64K. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 256kb (256k x 8) is the program memory size. It has supplied with other peripherals, such as brown-out detect/reset, dma, i2s, por, pwm, rng, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 1.8v ~ 3.6v. Moreover, the product comes in 64-tqfp exposed pad. The product has typical 144k x 8 RAM size. In addition, tray is the available packaging type of the product. It is a flash program memory type. In addition, it is reach unaffected. It provides connectivity solutions through flexcomm, i2c, mmc/sd/sdio, spi, uart/usart, usb. The product is a external, internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 36 is the I/O value of the product. It has a long 13 weeks standard lead time. It has a core size 32-bit single-core. The product is available in surface mount configuration. The product lpc552x, is a highly preferred choice for users. 64-htqfp (10x10) is the supplier device package value. The typical data converters include a/d 10x16b. arm® cortex®-m33 is the product's core processor. It has a robust speed of 150mhz. Moreover, it corresponds to lpc5526, a base product number of the product. The product is designated with the 5a992c code number.

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LPC552x Fact Sheet(Product Brief)
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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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LPC55yy Wafer Fab 02/May/2024(PCN Assembly/Origin)
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LPC55S6x/LPC55S2x/LPC552x 22/Dec/2022(PCN Design/Specification)
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LPC55x 17/Apr/2022(PCN Design/Specification)
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LPC55- 05/Feb/2023(PCN Packaging)

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