NXP USA Inc. MC68HC11E1VFNE3

MC68HC11E1VFNE3 NXP USA Inc.
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
-
Peripherals:
POR, WDT
Operating Temperature:
-40°C ~ 105°C (TA)
Voltage - Supply (Vcc/Vdd):
4.5V ~ 5.5V
Package / Case:
52-LCC (J-Lead)
RAM Size:
512 x 8
Program Memory Type:
ROMless
REACH Status:
REACH Unaffected
Connectivity:
SCI, SPI
Package:
Tube
EEPROM Size:
512 x 8
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Number of I/O:
38
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
HC11
Supplier Device Package:
52-PLCC (19.1x19.1)
Data Converters:
A/D 8x8b
Core Processor:
HC11
Speed:
3MHz
Base Product Number:
MC68HC11
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is MC68HC11E1VFNE3. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has supplied with other peripherals, such as por, wdt. The product has -40°c ~ 105°c (ta) operating temperature range. The supply voltage of a bespoke product includes 4.5v ~ 5.5v. Moreover, the product comes in 52-lcc (j-lead). The product has typical 512 x 8 RAM size. It is a romless program memory type. In addition, it is reach unaffected. It provides connectivity solutions through sci, spi. It is shipped in tube package . Furthermore, 512 x 8 is the typical EEPROM size of the product. The product is a internal type of oscillator. Its typical moisture sensitivity level is 3 (168 hours). 38 is the I/O value of the product. It has a core size 8-bit. The product is available in surface mount configuration. The product hc11, is a highly preferred choice for users. 52-plcc (19.1x19.1) is the supplier device package value. The typical data converters include a/d 8x8b. hc11 is the product's core processor. It has a robust speed of 3mhz. Moreover, it corresponds to mc68hc11, a base product number of the product. The product is designated with the ear99 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Assembly Site Transfer 7/Apr/2016(PCN Assembly/Origin)
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Mult Dev EOL 16/Dec/2021(PCN Obsolescence/ EOL)
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M68HC11E Family(Datasheets)
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Mult Dev Pkg Seal 15/Dec/2020(PCN Packaging)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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FAQs

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