NXP USA Inc. P80C32X2FN,112

P80C32X2FN-112 NXP USA Inc. P80C32X2FN,112
P80C32X2FN,112
NXP USA Inc.

Product Information

HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
-
Peripherals:
POR
Operating Temperature:
-40°C ~ 85°C (TA)
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Package / Case:
40-DIP (0.600", 15.24mm)
RAM Size:
256 x 8
Packaging:
Tube
Program Memory Type:
ROMless
REACH Status:
REACH Unaffected
Connectivity:
EBI/EMI, UART/USART
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Number of I/O:
32
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Through Hole
Series:
80C
Supplier Device Package:
40-DIP
Data Converters:
-
Core Processor:
8051
Speed:
33MHz
Base Product Number:
P80C32
ECCN:
3A991A2
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This is manufactured by NXP USA Inc.. The manufacturer part number is P80C32X2FN,112. It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. It has supplied with other peripherals, such as por. The product has -40°c ~ 85°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.7v ~ 5.5v. Moreover, the product comes in 40-dip (0.600", 15.24mm). The product has typical 256 x 8 RAM size. In addition, tube is the available packaging type of the product. It is a romless program memory type. In addition, it is reach unaffected. It provides connectivity solutions through ebi/emi, uart/usart. The product is a internal type of oscillator. Its typical moisture sensitivity level is 1 (unlimited). 32 is the I/O value of the product. It has a core size 8-bit. The product is available in through hole configuration. The product 80c, is a highly preferred choice for users. 40-dip is the supplier device package value. 8051 is the product's core processor. It has a robust speed of 33mhz. Moreover, it corresponds to p80c32, a base product number of the product. The product is designated with the 3a991a2 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Assembly Site Transfer 4/Jan/2016(PCN Assembly/Origin)
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Plating Process DIP Packages 16/Sep/2013(PCN Design/Specification)
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MCU Dip Supply Situation 12/May/2015(PCN Obsolescence/ EOL)
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EOL Product Assembly Site Transfer 13/Jun/2016(PCN Obsolescence/ EOL)
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P87C58X2FA(Datasheets)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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