Microchip Technology 24LC014-I/MC

24LC014-I-MC Microchip Technology 24LC014-I/MC
Microchip Technology

Product Information

HTSUS:
8542.32.0051
RoHS Status:
ROHS3 Compliant
DigiKey Programmable:
Not Verified
Memory Interface:
I2C
Write Cycle Time - Word, Page:
5ms
Operating Temperature:
-40°C ~ 85°C (TA)
Memory Size:
1Kbit
Package / Case:
8-VFDFN Exposed Pad
Packaging:
Tube
REACH Status:
REACH Unaffected
edacadModel:
24LC014-I/MC Models
edacadModelUrl:
/en/models/2059814
Memory Organization:
128 x 8
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Clock Frequency:
400 kHz
standardLeadTime:
6 Weeks
Access Time:
900 ns
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-DFN (2x3)
Memory Type:
Non-Volatile
Voltage - Supply:
2.5V ~ 5.5V
ECCN:
EAR99
Technology:
EEPROM
Base Product Number:
24LC014
Memory Format:
EEPROM
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This is manufactured by Microchip Technology. The manufacturer part number is 24LC014-I/MC. It is assigned with possible HTSUS value of 8542.32.0051. The product is rohs3 compliant. It is a i2c memory interface. It allows a 5ms of write cycle time. The product has -40°c ~ 85°c (ta) operating temperature range. It holds a typical memory size of 1kbit. Moreover, the product comes in 8-vfdfn exposed pad. In addition, tube is the available packaging type of the product. In addition, it is reach unaffected. While the product's memory is organised as 128 x 8. Its typical moisture sensitivity level is 1 (unlimited). The product boasts a clock frequency of 400 khz. It has a long 6 weeks standard lead time. It allows 900 ns access time. The product is available in surface mount configuration. 8-dfn (2x3) is the supplier device package value. It is a type of non-volatile memory type. It has optimum voltage supply of 2.5v ~ 5.5v. The product is designated with the ear99 code number. This product use eeprom technology. Moreover, it corresponds to 24lc014, a base product number of the product. It is a sort of eeprom memory.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Assermbly Site 02/Oct/2023(PCN Assembly/Origin)
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Lead Frame Update 29/Jun/2015(PCN Design/Specification)
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Mold Compound Update 18/Feb/2015(PCN Design/Specification)
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24AA014, 24LC014(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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