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The ATS-11H-125-C2-R0 is a robust component meticulously engineered to manage and dissipate heat from electronic devices. Its layout ensures that electronic components maintain optimal performance and an extended lifespan by effectively regulating their thermal conditions.
The ATS-11H-125-C2-R0 is a cutting-edge heat sink from Advanced Thermal Solutions Inc. (ATS). It is built to cool various electronic components, such as, Ball Grid Array (BGA), Land Grid Array (LGA), Central Processing Unit (CPU), Application-Specific Integrated Circuit (ASIC) etc. Its top-mounted layout enhances compatibility and user-friendly installation.
Advanced Thermal Solutions ATS-11H-125-C2-R0 is known for its consistent performance and high durability. It is created to handle rigorous operating conditions, ensuring long-lasting performance. Its robust design and the use of corrosion-resistant aluminium material elongate its lifespan, making it a valuable investment for managing heat in electronic components.
The ATS-11H-125-C2-R0 finds usage in a numerous applications. It can be utilised in many electronics like CPUs, BGAs, LGAs, and ASICs that produce a significant amount of heat. The efficient cooling mechanism aids in maintaining the operational efficiency of these devices, by improving the overall performance of the electronic components.
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