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United Kingdom
The ATS-06F-198-C2-R0 is robust heat control device tailored for optimal thermal management. Its compact format confirms adequate heat dissipation, protecting electronic components from potential overheating.
The ATS-06F-198-C2-R0 is a potent heatsink built to efficiently disperse heat from electronic components. With its efficient heat dissipation capabilities, robust XCUT T766 attachment, and versatility in applications, it proves to be a dependable option for engineers striving to address thermal challenges in their designs.
The ATS-06F-198-C2-R0 is built for optimal heat dissipation. Its cutting-edge thermal layout and materials qualify for the effective transfer of heat away from sensitive electronic devices, providing stable and reliable operation under demanding conditions.
The ATS-06F-198-C2-R0 heatsink's compact form factor is optimised for space-constrained environments, making it an ideal choice for modern electronics with limited space on PCBs or in tight enclosures. Despite its small size, it maintains superior thermal performance, providing adequate heat dissipation in limited areas.
The versatility of the ATS-06F-198-C2-R0 heatsink makes it a popular choice across various industries. It is widely employed in applications such as:
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