Silicon Labs EFM8BB31F32I-B-QFN24

EFM8BB31F32I-B-QFN24 Silicon Labs
EFM8BB31F32I-B-QFN24
EFM8BB31F32I-B-QFN24
Silicon Labs

Product Information

Dimensions:
3 x 3 x 0.85mm
USB Channels:
0
Width:
3mm
Program Memory Size:
32 kB
Number of PWM Units:
0
RAM Size:
2.304 kB
ADC Channels:
12
Number of Timers:
6
Data Bus Width:
8bit
Instruction Set Architecture:
Pipelined
Program Memory Type:
Flash
Package Type:
QFN
Maximum Frequency:
50MHz
Data Rate:
1.12Msps
Maximum Number of Ethernet Channels:
0
Family Name:
EFM8BB3
ADC Resolution:
12bit
Timer Resolution:
16bit
Timers:
6 x 16 bit
Number of ADC Units:
1
Pin Count:
24
Mounting Type:
Surface Mount
Length:
3mm
Height:
0.85mm
Typical Operating Supply Voltage:
2.2 → 3.6 V
ADCs:
1 (12 x 12 bit)
HTSUS:
8542.31.0001
RoHS Status:
ROHS3 Compliant
Program Memory Size:
32KB (32K x 8)
Number of I/O:
20
Operating Temperature:
-40°C ~ 125°C (TA)
Voltage - Supply (Vcc/Vdd):
2.2V ~ 3.6V
Package / Case:
24-VFQFN Exposed Pad
RAM Size:
2.25K x 8
Packaging:
Tube
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Program Memory Type:
FLASH
Connectivity:
I2C, SMBus, SPI, UART/USART
EEPROM Size:
-
Oscillator Type:
Internal
Moisture Sensitivity Level (MSL):
2 (1 Year)
DigiKey Programmable:
Not Verified
Core Size:
8-Bit
Mounting Type:
Surface Mount
Series:
Busy Bee
Supplier Device Package:
24-QFN (3x3)
Data Converters:
A/D 12x10/12b SAR; D/A 2x12b
Core Processor:
CIP-51 8051
Speed:
50MHz
Base Product Number:
EFM8BB31
ECCN:
3A991A2
RoHs Compliant
Checking for live stock

This is manufactured by Silicon Labs. The manufacturer part number is EFM8BB31F32I-B-QFN24. The given dimensions of the product include 3 x 3 x 0.85mm. The product integrates 0 USB channels. Furthermore, the product is 3mm wide. In addition, 32 kb is the program memory size. Furthermore, it is composed of 0 PWM units. The product has typical 2.304 kb RAM size. Additionally, it is composed of 12 ADC channels. It comprises 6 timers. Moreover, the data bus width includes 8bit. The instruction set has pipelined architecture. It is a flash program memory type. The package is a sort of qfn. It features 50mhz of maximum frequency. It has a maximised data speed rate of 1.12msps. Moreover, the product includes 0 maximum ethernet channels . The product belongs to a family efm8bb3. The ADC has 12bit resolution. The timer has 16bit resolution. Timers options include 6 x 16 bit. It contains 1 ADC units. It contains 24 pins. The product is available in surface mount configuration. Its accurate length is 3mm. In addition, the height is 0.85mm. It has 2.2 → 3.6 v of typical operating supply voltage. The ADCs included 1 (12 x 12 bit). It is assigned with possible HTSUS value of 8542.31.0001. The product is rohs3 compliant. In addition, 32kb (32k x 8) is the program memory size. 20 is the I/O value of the product. The product has -40°c ~ 125°c (ta) operating temperature range. The supply voltage of a bespoke product includes 2.2v ~ 3.6v. Moreover, the product comes in 24-vfqfn exposed pad. The product has typical 2.25k x 8 RAM size. In addition, tube is the available packaging type of the product. It has supplied with other peripherals, such as brown-out detect/reset, por, pwm, wdt. It is a flash program memory type. It provides connectivity solutions through i2c, smbus, spi, uart/usart. The product is a internal type of oscillator. Its typical moisture sensitivity level is 2 (1 year). It has a core size 8-bit. The product busy bee, is a highly preferred choice for users. 24-qfn (3x3) is the supplier device package value. The typical data converters include a/d 12x10/12b sar; d/a 2x12b. cip-51 8051 is the product's core processor. It has a robust speed of 50mhz. Moreover, it corresponds to efm8bb31, a base product number of the product. The product is designated with the 3a991a2 code number.

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ESD Control Selection Guide V1(Technical Reference)
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EFM8BB3x Family 8-bit Microcontrollers datasheet(Technical Reference)
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EFM8BB3 Datasheet(Datasheets)
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Mult Dev Revision 23/Jan/2019(PCN Design/Specification)
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EFM8 24/May/2017(PCN Design/Specification)
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Mult DEV Box/Shipping Label 20/Mar/2024(PCN Packaging)
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IC/SIP MOQ Chg 11/Jan/2022(PCN Packaging)

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