Texas Instruments LMC6772BIM/NOPB

LMC6772BIM-NOPB Texas Instruments LMC6772BIM/NOPB
Texas Instruments

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Current - Input Bias (Max):
0.04pA @ 5V
Current - Quiescent (Max):
20µA
Operating Temperature:
-40°C ~ 85°C
Voltage - Supply, Single/Dual (±):
2.7V ~ 15V, ±1.35V ~ 7.5V
Package / Case:
8-SOIC (0.154", 3.90mm Width)
Type:
General Purpose
Propagation Delay (Max):
10µs
edacadModel:
LMC6772BIM/NOPB Models
REACH Status:
REACH Unaffected
Output Type:
Open-Drain
Hysteresis:
-
edacadModelUrl:
/en/models/241925
CMRR, PSRR (Typ):
75dB CMRR, 80dB PSRR
Package:
Tube
Voltage - Input Offset (Max):
15mV @ 5V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Current - Output (Typ):
30mA
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-SOIC
Number of Elements:
2
Base Product Number:
LMC6772
ECCN:
EAR99
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This is manufactured by Texas Instruments. The manufacturer part number is LMC6772BIM/NOPB. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The maximum input bias current includes 0.04pa @ 5v. It has a maximum quiescent current of 20µa. The product has -40°c ~ 85°c operating temperature range. It features a typical 2.7v ~ 15v, ±1.35v ~ 7.5v voltage of single or dual. Moreover, the product comes in 8-soic (0.154", 3.90mm width). It comes in general purpose configuration. Has a maximum 10µs propagation delay. In addition, it is reach unaffected. Furthermore, it has aopen-drain output. Typical CMRR, PSRR of 75db cmrr, 80db psrr. It is shipped in tube package . The maximum input offset voltage of 15mv @ 5v. Its typical moisture sensitivity level is 1 (unlimited). Features a typical output current of 30ma. The product is available in surface mount configuration. 8-soic is the supplier device package value. It carries 2 elements. Moreover, it corresponds to lmc6772, a base product number of the product. The product is designated with the ear99 code number.

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Mult Devices Wafer Fab Site 09/Mar/2017(PCN Assembly/Origin)
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Mold Compound 24/Mar/2016(PCN Design/Specification)
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Mult Dev EOL 7/Sep/2023(PCN Obsolescence/ EOL)

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