Microchip Technology ZL40260LDG1

ZL40260LDG1 Microchip Technology
Microchip Technology

Product Information

HTSUS:
8541.60.0080
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 85°C
Package / Case:
32-VFQFN Exposed Pad
Input:
CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL
Type:
Fanout Buffer (Distribution), Multiplexer
Ratio - Input:Output:
2:10
REACH Status:
REACH Unaffected
Differential - Input:Output:
Yes/Yes
Frequency - Max:
1.6 GHz
Manufacturer:
Microchip Technology
Moisture Sensitivity Level (MSL):
3 (168 Hours)
Output:
LVPECL
Number of Circuits:
1
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
32-QFN (5x5)
Packaging:
Tray
Voltage - Supply:
2.375V ~ 3.465V
Base Product Number:
ZL40260
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is ZL40260LDG1. It is assigned with possible HTSUS value of 8541.60.0080. The product is rohs3 compliant. The product has -40°c ~ 85°c operating temperature range. Moreover, the product comes in 32-vfqfn exposed pad. Its input values include cml, hcsl, lvcmos, lvds, lvpecl, sstl. It comes in fanout buffer (distribution), multiplexer configuration. The ratio between its input and output is 2:10. In addition, it is reach unaffected. The differential input and output values included: yes/yes. It maximum frequency is 1.6 ghz. The microchip technology's product offers user-desired applications. Its typical moisture sensitivity level is 3 (168 hours). Moreover, the product allow the output of lvpecl. It integrates 1 circuits. The product is available in surface mount configuration. 32-qfn (5x5) is the supplier device package value. In addition, tray is the available packaging type of the product. It has optimum voltage supply of 2.375v ~ 3.465v. Moreover, it corresponds to zl40260, a base product number of the product. The product is designated with the ear99 code number.

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ZL40260yyy 27/Oct/2021(PCN Obsolescence/ EOL)
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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Bond Wire 08/Nov/2019(PCN Assembly/Origin)
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Marking Change 05/Apr/2019(PCN Design/Specification)
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Mult Devices 06/May/2019(PCN Other)
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Packing Changes 07/Jul/2019(PCN Packaging)
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Part Number Change 05/Apr/2019(PCN Part Number)

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FAQs

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