Forced Convection Reflow Oven FT03 The FT03 oven is compatible with high temperature alloys and above all "lead free" ones thanks to its new heating system and its electronics. This reflow oven has been concieved to the reflow of solder paste and polymerization of the glues for prototyping.Includes 10 program memorization, information display on the LCD monitor and a viewing window to supervise the process.Features Compact model, but working area of 190 x 290 mmHeating through forced convectionTemperature control by microprocessor, max. T 300CView of the card thanks to a large window on the front panelEasy programming for immediate controlSafety: double window with air circulation, closing door accessPCB Assembly Equipment