Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive

HF650P-0-001-01-00-122 Thermal Interface Pad, Hi-Flow 650P, 1.5W/m·K 0.001in, Self-Adhesive
HF650P-0.001-01-00-122
Bergquist

Product Information

Self-Adhesive:
Yes
Thermal Conductivity:
1.5W/m·K
Operating Temperature Range:
-40 → +150 °C
Material:
Hi-Flow 650P
Thickness:
0.001in
Minimum Operating Temperature:
-40°C
Material Trade Name:
Hi-Flow 650P
Maximum Operating Temperature:
+150°C
RoHs Compliant
Checking for live stock

This is Thermal Interface Pad Hi-Flow 650P 1.5W/m·K 0.001in Self-Adhesive manufactured by Bergquist. The manufacturer part number is HF650P-0.001-01-00-122. Additionally, it is self-adhesive yes . It features thermal conductivity of 1.5w/m·k. The product has -40 → +150 °c of operating temperature range. The product is made from highly stable and reliable hi-flow 650p. It is 0.001in thick. Whereas, the minimum operating temperature of the product is -40°c. The material trade name is hi-flow 650p . It has a maximum operating temperature of +150°c.

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Hi-Flow® 650P(Technical Reference)

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FAQs

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