Taiwan Semiconductor Corporation SMCJ58CA

SMCJ58CA Taiwan Semiconductor Corporation
Taiwan Semiconductor Corporation

Product Information

Voltage - Clamping (Max) @ Ipp:
93.6V
HTSUS:
8541.10.0080
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-
Package / Case:
DO-214AB, SMC
Type:
Zener
REACH Status:
REACH Unaffected
Voltage - Breakdown (Min):
64.4V
edacadModel:
SMCJ58CA Models
Applications:
General Purpose
edacadModelUrl:
/en/models/1052597
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Bidirectional Channels:
1
standardLeadTime:
16 Weeks
Current - Peak Pulse (10/1000µs):
16A
Voltage - Reverse Standoff (Typ):
58V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
DO-214AB (SMC)
Packaging:
Tape & Reel (TR)
Capacitance @ Frequency:
-
Power Line Protection:
No
Power - Peak Pulse:
1500W (1.5kW)
Base Product Number:
SMCJ58
ECCN:
EAR99
Checking for live stock

This is manufactured by Taiwan Semiconductor Corporation. The manufacturer part number is SMCJ58CA. The maximum clamping voltage is 93.6v. It is assigned with possible HTSUS value of 8541.10.0080. The product is rohs3 compliant. Moreover, the product comes in do-214ab, smc. It comes in zener configuration. In addition, it is reach unaffected. The minimum breakdown voltage is 64.4v. The product is widely employed in general purpose. Its typical moisture sensitivity level is 1 (unlimited). The product has 1 bidirectional channels. It has a long 16 weeks standard lead time. The peak pulse of the product is given as 16a. Provide with the typical reverse standoff voltage of 58v. The product is available in surface mount configuration. do-214ab (smc) is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. Power Line Protection: no. Furthermore, the peak pulse power of the product is 1500w (1.5kw). Moreover, it corresponds to smcj58, a base product number of the product. The product is designated with the ear99 code number.

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Taiwan Semi RoHS(Environmental Information)
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Taiwan Semi REACH(Environmental Information)
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Mult Dev Mold Comp Chgs 21/Nov/2017(PCN Assembly/Origin)
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Mult Dev Logo Chg 22/Nov/2019(PCN Design/Specification)
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Mult Dev Part Marking Chg 25/Jun/2018(PCN Design/Specification)
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SMCJ5.0(A) – SMCJ170(A)(Datasheets)
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Mult Devices 24/Oct/2017(PCN Packaging)

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FAQs

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