onsemi HGTG30N60A4D

HGTG30N60A4D onsemi
onsemi

Product Information

Current - Collector (Ic) (Max):
75 A
HTSUS:
8541.29.0095
RoHS Status:
ROHS3 Compliant
Switching Energy:
280µJ (on), 240µJ (off)
Vce(on) (Max) @ Vge, Ic:
2.6V @ 15V, 30A
Voltage - Collector Emitter Breakdown (Max):
600 V
Td (on/off) @ 25°C:
25ns/150ns
Operating Temperature:
-55°C ~ 150°C (TJ)
Input Type:
Standard
Package / Case:
TO-247-3
Gate Charge:
225 nC
Reverse Recovery Time (trr):
55 ns
REACH Status:
REACH Unaffected
Test Condition:
390V, 30A, 3Ohm, 15V
Package:
Tube
Moisture Sensitivity Level (MSL):
Not Applicable
standardLeadTime:
59 Weeks
IGBT Type:
-
Current - Collector Pulsed (Icm):
240 A
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
TO-247-3
Power - Max:
463 W
Base Product Number:
HGTG30N60
ECCN:
EAR99
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This is manufactured by onsemi. The manufacturer part number is HGTG30N60A4D. The maximum collector current includes 75 a. It is assigned with possible HTSUS value of 8541.29.0095. The product is rohs3 compliant. Provide switching energy up to 280µj (on), 240µj (off). Features 2.6v @ 15v, 30a. The maximum collector emitter breakdown voltage of the product is 600 v. Td (on/off) value of 25ns/150ns. The product has -55°c ~ 150°c (tj) operating temperature range. It carries standard input type. Moreover, the product comes in to-247-3. Features 225 nc gate charge. It has a trr (reverse recovery time) of 55 ns. In addition, it is reach unaffected. Test condition included 390v, 30a, 3ohm, 15v. It is shipped in tube package . Its typical moisture sensitivity level is not applicable. It has a long 59 weeks standard lead time. With a current - collector pulsed of [Current - Collector Pulsed (lcm)] . The product is available in through hole configuration. to-247-3 is the supplier device package value. The maximum power of the product is 463 w. Moreover, it corresponds to hgtg30n60, a base product number of the product. The product is designated with the ear99 code number.

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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Wafer Fab Change 27/Dec/2022(PCN Assembly/Origin)
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Dimension/Color Change 24/Feb/2021(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Obsolete Notice 30/Sep/2022(PCN Obsolescence/ EOL)
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HGTG30N60A4D(Datasheets)
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Mult Devices 24/Oct/2017(PCN Packaging)
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Packing quantity increase 28/Dec/2020(PCN Packaging)

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