onsemi FGA30T65SHD

FGA30T65SHD onsemi
onsemi

Product Information

Current - Collector (Ic) (Max):
60 A
HTSUS:
8541.29.0095
RoHS Status:
ROHS3 Compliant
Switching Energy:
598µJ (on), 167µJ (off)
Vce(on) (Max) @ Vge, Ic:
2.1V @ 15V, 30A
Voltage - Collector Emitter Breakdown (Max):
650 V
Td (on/off) @ 25°C:
14.4ns/52.8ns
Operating Temperature:
-55°C ~ 175°C (TJ)
Input Type:
Standard
Package / Case:
TO-3P-3, SC-65-3
Gate Charge:
54.7 nC
Reverse Recovery Time (trr):
31.8 ns
REACH Status:
REACH Unaffected
Test Condition:
400V, 30A, 6Ohm, 15V
Package:
Tube
Moisture Sensitivity Level (MSL):
Not Applicable
IGBT Type:
Trench Field Stop
Current - Collector Pulsed (Icm):
90 A
Mounting Type:
Through Hole
Series:
-
Supplier Device Package:
TO-3PN
Power - Max:
238 W
Base Product Number:
FGA30T65
ECCN:
EAR99
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This is manufactured by onsemi. The manufacturer part number is FGA30T65SHD. The maximum collector current includes 60 a. It is assigned with possible HTSUS value of 8541.29.0095. The product is rohs3 compliant. Provide switching energy up to 598µj (on), 167µj (off). Features 2.1v @ 15v, 30a. The maximum collector emitter breakdown voltage of the product is 650 v. Td (on/off) value of 14.4ns/52.8ns. The product has -55°c ~ 175°c (tj) operating temperature range. It carries standard input type. Moreover, the product comes in to-3p-3, sc-65-3. Features 54.7 nc gate charge. It has a trr (reverse recovery time) of 31.8 ns. In addition, it is reach unaffected. Test condition included 400v, 30a, 6ohm, 15v. It is shipped in tube package . Its typical moisture sensitivity level is not applicable. Features an IGBT trench field stop type. With a current - collector pulsed of [Current - Collector Pulsed (lcm)] . The product is available in through hole configuration. to-3pn is the supplier device package value. The maximum power of the product is 238 w. Moreover, it corresponds to fga30t65, a base product number of the product. The product is designated with the ear99 code number.

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onsemi RoHS(Environmental Information)
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onsemi REACH(Environmental Information)
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Wafer Fab Change 11/Oct/2021(PCN Assembly/Origin)
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Dimension/Color Change 24/Feb/2021(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Dev EOL 30/Jun/2022(PCN Obsolescence/ EOL)
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Mult Devices 24/Oct/2017(PCN Packaging)
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Packing quantity increase 28/Dec/2020(PCN Packaging)

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