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Infineon Technologies F3L200R07W2S5B11BOMA1

Infineon Technologies

Product Information

HTSUS:
8541.29.0095
title:
F3L200R07W2S5B11BOMA1
Series:
*
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Packaging:
Tray
standardLeadTime:
26 Weeks
Manufacturer:
Infineon Technologies
ECCN:
EAR99
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This is manufactured by Infineon Technologies. The manufacturer part number is F3L200R07W2S5B11BOMA1. It is assigned with possible HTSUS value of 8541.29.0095. The product is rohs3 compliant. In addition, it is reach unaffected. Its typical moisture sensitivity level is 1 (unlimited). In addition, tray is the available packaging type of the product. It has a long 26 weeks standard lead time. The infineon technologies's product offers user-desired applications. The product is designated with the ear99 code number.

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FAQs

Yes. You can also search F3L200R07W2S5B11BOMA1 on website for other similar products.
We accept all major payment methods for all products including ET22629547. Please check your shopping cart at the time of order.
You can order Infineon Technologies brand products with F3L200R07W2S5B11BOMA1 directly through our website or call us at +44 (0) 3303 800 157 or email our support team at sales@enrgtech.co.uk.
Yes. Our products in IGBT Modules category are shipped in lowest possible time.
You will get a confirmation email regarding your order of Infineon Technologies F3L200R07W2S5B11BOMA1. You can also check on our website or by contacting our customer support team for further order details on Infineon Technologies F3L200R07W2S5B11BOMA1.
We use our internationally recognized delivery partners UPS/DHL. Collection of ET22629547 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Infineon Technologies" products on our website by using Enrgtech's Unique Manufacturing Part Number ET22629547.
Yes. We ship F3L200R07W2S5B11BOMA1 Internationally to many countries around the world.
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