Microsemi Corporation APTGF90TDU60PG

Microsemi Corporation

Product Information

Input Capacitance (Cies) @ Vce:
4.3nF @ 25V
Current - Collector (Ic) (Max):
110A
Detailed Description:
IGBT Module NPT Triple, Dual - Common Source 600V 110A 416W Chassis Mount SP6-P
Configuration:
Triple, Dual - Common Source
Mounting Type:
Chassis Mount
Current - Collector Cutoff (Max):
250µA
Vce(on) (Max) @ Vge, Ic:
2.5V @ 15V, 90A
Supplier Device Package:
SP6-P
Voltage - Collector Emitter Breakdown (Max):
600V
Packaging:
Bulk
Operating Temperature:
-40°C ~ 150°C (TJ)
Power - Max:
416W
Customer Reference:
Package / Case:
SP6
Input:
Standard
IGBT Type:
NPT
NTC Thermistor:
No
Manufacturer:
Microsemi Corporation
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This is manufactured by Microsemi Corporation. The manufacturer part number is APTGF90TDU60PG. It holds 4.3nf @ 25v of input capacitance. The maximum collector current includes 110a. It features igbt module npt triple, dual - common source 600v 110a 416w chassis mount sp6-p. The product is available in triple, dual - common source configuration. The product is available in chassis mount configuration. In addition, 250µa is the maximum current at collector cutoff. Features 2.5v @ 15v, 90a. sp6-p is the supplier device package value. The maximum collector emitter breakdown voltage of the product is 600v. In addition, bulk is the available packaging type of the product. The product has -40°c ~ 150°c (tj) operating temperature range. The maximum power of the product is 416w. Moreover, the product comes in sp6. Its input values include standard. Features an IGBT npt type. NTC Thermistor - no. The microsemi corporation's product offers user-desired applications.

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APTGF90TDU60PG(Datasheets)

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We use our internationally recognized delivery partners UPS/DHL. Collection of ET16025357 can also be arranged for the customer by international shipments through contacting our customer support team. Additionally, you can also search "Microsemi Corporation" products on our website by using Enrgtech's Unique Manufacturing Part Number ET16025357.
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