Renesas Electronics America Inc UPA2766T1A-E2-AY

UPA2766T1A-E2-AY Renesas Electronics America Inc
Renesas Electronics America Inc

Product Information

FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
-
Operating Temperature:
150°C (TJ)
Package / Case:
8-PowerVDFN
Rds On (Max) @ Id, Vgs:
1.82mOhm @ 39A, 4.5V
Gate Charge (Qg) (Max) @ Vgs:
257 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Affected
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
30 V
Vgs (Max):
±20V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
1.5W (Ta), 83W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
10850 pF @ 10 V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-HVSON (5x5.4)
Current - Continuous Drain (Id) @ 25°C:
130A (Tc)
Technology:
MOSFET (Metal Oxide)
ECCN:
EAR99
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This is manufactured by Renesas Electronics America Inc. The manufacturer part number is UPA2766T1A-E2-AY. It is assigned with possible HTSUS value of 8541.29.0095. The product has 150°c (tj) operating temperature range. Moreover, the product comes in 8-powervdfn. It has a maximum Rds On and voltage of 1.82mohm @ 39a, 4.5v. The maximum gate charge and given voltages include 257 nc @ 10 v. The product is rohs3 compliant. In addition, it is reach affected. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. It is shipped in tape & reel (tr) package . The product has a 30 v drain to source voltage. The maximum Vgs rate is ±20v. Its typical moisture sensitivity level is 1 (unlimited). The product carries maximum power dissipation 1.5w (ta), 83w (tc). The product's input capacitance at maximum includes 10850 pf @ 10 v. The product is available in surface mount configuration. 8-hvson (5x5.4) is the supplier device package value. The continuous current drain at 25°C is 130a (tc). This product use mosfet (metal oxide) technology. The product is designated with the ear99 code number.

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Multiple Devices 28/Aug/2013(PCN Obsolescence/ EOL)
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Wafer Fabrication Site Change 10/Oct/2013(PCN Assembly/Origin)
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Label Change-All Devices 01/Dec/2022(PCN Packaging)

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FAQs

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