Rohm Semiconductor RQ5A025ZPTL

RQ5A025ZPTL Rohm Semiconductor
Rohm Semiconductor

Product Information

Manufacturer Standard Lead Time:
16 Weeks
Detailed Description:
P-Channel 12V 2.5A (Ta) 760mW (Ta) Surface Mount TSMT3
Vgs(th) (Max) @ Id:
1V @ 1mA
Operating Temperature:
150°C (TJ)
Package / Case:
SC-96
Base Part Number:
RQ5A025
Gate Charge (Qg) (Max) @ Vgs:
13nC @ 4.5V
Rds On (Max) @ Id, Vgs:
61mOhm @ 2.5A, 4.5V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
1.5V, 4.5V
Manufacturer:
Rohm Semiconductor
Drain to Source Voltage (Vdss):
12V
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
1350pF @ 6V
Mounting Type:
Surface Mount
Supplier Device Package:
TSMT3
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
2.5A (Ta)
Customer Reference:
Power Dissipation (Max):
760mW (Ta)
Technology:
MOSFET (Metal Oxide)
Checking for live stock

This is manufactured by Rohm Semiconductor. The manufacturer part number is RQ5A025ZPTL. It has typical 16 weeks of manufacturer standard lead time. It features p-channel 12v 2.5a (ta) 760mw (ta) surface mount tsmt3. The typical Vgs (th) (max) of the product is 1v @ 1ma. The product has 150°c (tj) operating temperature range. Moreover, the product comes in sc-96. Base Part Number: rq5a025. The maximum gate charge and given voltages include 13nc @ 4.5v. It has a maximum Rds On and voltage of 61mohm @ 2.5a, 4.5v. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 1.5v, 4.5v. The rohm semiconductor's product offers user-desired applications. The product has a 12v drain to source voltage. The maximum Vgs rate is ±10v. The product's input capacitance at maximum includes 1350pf @ 6v. The product is available in surface mount configuration. tsmt3 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 2.5a (ta). The product carries maximum power dissipation 760mw (ta). This product use mosfet (metal oxide) technology.

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