NXP USA Inc. PSMN3R7-25YLC,115

NXP USA Inc.

Product Information

Base Part Number:
PSMN3
Detailed Description:
N-Channel 25V 97A (Tc) 64W (Tc) Surface Mount LFPAK56, Power-SO8
Input Capacitance (Ciss) (Max) @ Vds:
1585pF @ 12V
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
1.95V @ 1mA
Drain to Source Voltage (Vdss):
25V
Vgs (Max):
±20V
Gate Charge (Qg) (Max) @ Vgs:
21.6nC @ 10V
Rds On (Max) @ Id, Vgs:
3.9mOhm @ 20A, 10V
Supplier Device Package:
LFPAK56, Power-SO8
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 175°C (TJ)
FET Type:
N-Channel
Customer Reference:
Package / Case:
SC-100, SOT-669
Power Dissipation (Max):
64W (Tc)
Current - Continuous Drain (Id) @ 25°C:
97A (Tc)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
NXP USA Inc.
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This is manufactured by NXP USA Inc.. The manufacturer part number is PSMN3R7-25YLC,115. Base Part Number: psmn3. It features n-channel 25v 97a (tc) 64w (tc) surface mount lfpak56, power-so8. The product's input capacitance at maximum includes 1585pf @ 12v. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The product is available in surface mount configuration. The typical Vgs (th) (max) of the product is 1.95v @ 1ma. The product has a 25v drain to source voltage. The maximum Vgs rate is ±20v. The maximum gate charge and given voltages include 21.6nc @ 10v. It has a maximum Rds On and voltage of 3.9mohm @ 20a, 10v. lfpak56, power-so8 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 175°c (tj) operating temperature range. It carries FET type n-channel. Moreover, the product comes in sc-100, sot-669. The product carries maximum power dissipation 64w (tc). The continuous current drain at 25°C is 97a (tc). This product use mosfet (metal oxide) technology. The nxp usa inc.'s product offers user-desired applications.

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Multiple Devices 25/Dec/2013(PCN Obsolescence/ EOL)
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PSMN3R7-25YLC(Datasheets)
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NXP RoHS3 Cert(Environmental Information)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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