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Renesas Electronics America 2SJ687-ZK-E1-AY

2SJ687-ZK-E1-AY Renesas Electronics America
Renesas Electronics America

Product Information

Rds On (Max) @ Id, Vgs:
7mOhm @ 10A, 4.5V
Detailed Description:
P-Channel 20V 20A (Tc) 1W (Ta), 36W (Tc) Surface Mount TO-252 (MP-3ZK)
Input Capacitance (Ciss) (Max) @ Vds:
4400pF @ 10V
Mounting Type:
Surface Mount
Gate Charge (Qg) (Max) @ Vgs:
57nC @ 4.5V
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±12V
Supplier Device Package:
TO-252 (MP-3ZK)
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Packaging:
Cut Tape (CT)
Operating Temperature:
150°C (TJ)
FET Type:
P-Channel
Package / Case:
TO-252-3, DPak (2 Leads + Tab), SC-63
Power Dissipation (Max):
1W (Ta), 36W (Tc)
Current - Continuous Drain (Id) @ 25°C:
20A (Tc)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
Renesas Electronics America
Checking for live stock

This is manufactured by Renesas Electronics America. The manufacturer part number is 2SJ687-ZK-E1-AY. It has a maximum Rds On and voltage of 7mohm @ 10a, 4.5v. It features p-channel 20v 20a (tc) 1w (ta), 36w (tc) surface mount to-252 (mp-3zk). The product's input capacitance at maximum includes 4400pf @ 10v. The product is available in surface mount configuration. The maximum gate charge and given voltages include 57nc @ 4.5v. The product has a 20v drain to source voltage. The maximum Vgs rate is ±12v. to-252 (mp-3zk) is the supplier device package value. The minimum and maximum Rds On drive voltage includes [Drive Voltage (Max Rds On, Min Rds On)]. In addition, cut tape (ct) is the available packaging type of the product. The product has 150°c (tj) operating temperature range. It carries FET type p-channel. Moreover, the product comes in to-252-3, dpak (2 leads + tab), sc-63. The product carries maximum power dissipation 1w (ta), 36w (tc). The continuous current drain at 25°C is 20a (tc). This product use mosfet (metal oxide) technology. The renesas electronics america's product offers user-desired applications.

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Multiple Devices 28/Aug/2013(PCN Obsolescence/ EOL)
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Wafer Fabrication Site Change 10/Oct/2013(PCN Assembly/Origin)
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2SJ687(Datasheets)

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