ON Semiconductor MCH5839-TL-H

ON Semiconductor

Product Information

FET Feature:
Schottky Diode (Isolated)
Manufacturer Standard Lead Time:
2 Weeks
Detailed Description:
P-Channel 20V 1.5A (Ta) 800mW (Ta) Surface Mount 5-MCPH
Operating Temperature:
150°C (TJ)
Package / Case:
6-SMD (5 Leads), Flat Lead
Base Part Number:
MCH5839
Gate Charge (Qg) (Max) @ Vgs:
1.7nC @ 4.5V
Rds On (Max) @ Id, Vgs:
266mOhm @ 750mA, 4.5V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±10V
Input Capacitance (Ciss) (Max) @ Vds:
120pF @ 10V
Mounting Type:
Surface Mount
Supplier Device Package:
5-MCPH
Packaging:
Tape & Reel (TR)
Current - Continuous Drain (Id) @ 25°C:
1.5A (Ta)
Customer Reference:
Power Dissipation (Max):
800mW (Ta)
Technology:
MOSFET (Metal Oxide)
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is MCH5839-TL-H. The FET features of the product include schottky diode (isolated). It has typical 2 weeks of manufacturer standard lead time. It features p-channel 20v 1.5a (ta) 800mw (ta) surface mount 5-mcph. The product has 150°c (tj) operating temperature range. Moreover, the product comes in 6-smd (5 leads), flat lead. Base Part Number: mch5839. The maximum gate charge and given voltages include 1.7nc @ 4.5v. It has a maximum Rds On and voltage of 266mohm @ 750ma, 4.5v. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 1.8v, 4.5v. The on semiconductor's product offers user-desired applications. The product has a 20v drain to source voltage. The maximum Vgs rate is ±10v. The product's input capacitance at maximum includes 120pf @ 10v. The product is available in surface mount configuration. 5-mcph is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The continuous current drain at 25°C is 1.5a (ta). The product carries maximum power dissipation 800mw (ta). This product use mosfet (metal oxide) technology.

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Wafer Fab Site Addition 03/Dec/2014(PCN Assembly/Origin)
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MCH5839(Datasheets)
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Copper Wire Update 02/Dec/2014(PCN Design/Specification)
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Raw Material Change 22/Jul/2015(PCN Design/Specification)

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