Maximum Drain Source Voltage:
100 V
Typical Gate Charge @ Vgs:
85 nC @ 10 V
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
3.75 W
Maximum Gate Source Voltage:
-25 V, +25 V
Height:
4.83mm
Width:
9.65mm
Length:
10.67mm
Minimum Gate Threshold Voltage:
2V
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Continuous Drain Current:
33 A
Transistor Material:
Si
Maximum Drain Source Resistance:
60 mΩ
Channel Type:
P
Maximum Operating Temperature:
+175 °C
Pin Count:
3
Transistor Configuration:
Single
Manufacturer Standard Lead Time:
27 Weeks
Detailed Description:
P-Channel 100V 33.5A (Tc) 3.75W (Ta), 155W (Tc) Surface Mount D²PAK (TO-263AB)
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Base Part Number:
FQB3
Gate Charge (Qg) (Max) @ Vgs:
110nC @ 10V
Rds On (Max) @ Id, Vgs:
60mOhm @ 16.75A, 10V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
100V
Vgs (Max):
±25V
Input Capacitance (Ciss) (Max) @ Vds:
2910pF @ 25V
Mounting Type:
Surface Mount
Series:
QFET®
Supplier Device Package:
D²PAK (TO-263AB)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
33.5A (Tc)
Customer Reference:
Power Dissipation (Max):
3.75W (Ta), 155W (Tc)
Technology:
MOSFET (Metal Oxide)
