ON Semiconductor FDN371N

FDN371N ON Semiconductor
ON Semiconductor

Product Information

Detailed Description:
N-Channel 20V 2.5A (Ta) 500mW (Ta) Surface Mount SuperSOT-3
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-236-3, SC-59, SOT-23-3
Base Part Number:
FDN371
Gate Charge (Qg) (Max) @ Vgs:
10.7nC @ 4.5V
Rds On (Max) @ Id, Vgs:
50mOhm @ 2.5A, 4.5V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
2.5V, 4.5V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±12V
Input Capacitance (Ciss) (Max) @ Vds:
815pF @ 10V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
SuperSOT-3
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
2.5A (Ta)
Customer Reference:
Power Dissipation (Max):
500mW (Ta)
Technology:
MOSFET (Metal Oxide)
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDN371N. It features n-channel 20v 2.5a (ta) 500mw (ta) surface mount supersot-3. The typical Vgs (th) (max) of the product is 1.5v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-236-3, sc-59, sot-23-3. Base Part Number: fdn371. The maximum gate charge and given voltages include 10.7nc @ 4.5v. It has a maximum Rds On and voltage of 50mohm @ 2.5a, 4.5v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 2.5v, 4.5v. The on semiconductor's product offers user-desired applications. The product has a 20v drain to source voltage. The maximum Vgs rate is ±12v. The product's input capacitance at maximum includes 815pf @ 10v. The product is available in surface mount configuration. The product powertrench®, is a highly preferred choice for users. supersot-3 is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 2.5a (ta). The product carries maximum power dissipation 500mw (ta). This product use mosfet (metal oxide) technology.

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FDN371N(Datasheets)
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Mold Compound 08/April/2008(PCN Design/Specification)
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Wire Bonding 07/Nov/2008(PCN Design/Specification)
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Status Chg 22/Feb/2017(PCN Part Status Change)
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Binary Year Code Marking 15/Jan/2014(PCN Packaging)

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