ON Semiconductor FDMA8878

FDMA8878 ON Semiconductor
FDMA8878
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
10 A
Transistor Material:
Si
Width:
2mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
30 V
Package Type:
MLP
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1.2V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
8.5 nC @ 10 V
Channel Type:
N
Length:
2mm
Pin Count:
6
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
2.4 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
0.725mm
Minimum Operating Temperature:
-55 °C
Forward Diode Voltage:
1.2V
Maximum Drain Source Resistance:
21 mΩ
Manufacturer Standard Lead Time:
52 Weeks
Detailed Description:
N-Channel 30V 9A (Ta), 10A (Tc) 2.4W (Ta) Surface Mount 6-MicroFET (2x2)
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
6-WDFN Exposed Pad
Base Part Number:
FDMA88
Gate Charge (Qg) (Max) @ Vgs:
12nC @ 10V
Rds On (Max) @ Id, Vgs:
16mOhm @ 9A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
30V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
720pF @ 15V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
6-MicroFET (2x2)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
9A (Ta), 10A (Tc)
Customer Reference:
Power Dissipation (Max):
2.4W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDMA8878. While 10 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 2mm wide. The product offers single transistor configuration. It has a maximum of 30 v drain source voltage. The package is a sort of mlp. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 1.2v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 8.5 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 2mm. It contains 6 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 2.4 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -20 v, +20 v. In addition, the height is 0.725mm. Whereas, the minimum operating temperature of the product is -55 °c. Its forward diode voltage is 1.2v . It provides up to 21 mω maximum drain source resistance. It has typical 52 weeks of manufacturer standard lead time. It features n-channel 30v 9a (ta), 10a (tc) 2.4w (ta) surface mount 6-microfet (2x2). The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 6-wdfn exposed pad. Base Part Number: fdma88. The maximum gate charge and given voltages include 12nc @ 10v. It has a maximum Rds On and voltage of 16mohm @ 9a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The on semiconductor's product offers user-desired applications. The product has a 30v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 720pf @ 15v. The product powertrench®, is a highly preferred choice for users. 6-microfet (2x2) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 9a (ta), 10a (tc). The product carries maximum power dissipation 2.4w (ta). This product use mosfet (metal oxide) technology.

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FDMA8878, Single N-Channel PowerTrench MOSFET 30V 9A 16mOhm Data Sheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Qualify 2nd supplier 13/Aug/2020(PCN Assembly/Origin)
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FDMA8878(Datasheets)
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Marking Content 19/Nov/2013(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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