ON Semiconductor FDMA7628

FDMA7628 ON Semiconductor
FDMA7628
ON Semiconductor

Product Information

Category:
Power MOSFET
Dimensions:
2 x 2 x 0.75mm
Maximum Continuous Drain Current:
9 A
Transistor Material:
Si
Width:
2mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
20 V
Package Type:
MLP
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
0.4V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
17.5 nC @ 4.5 V
Channel Type:
N
Typical Input Capacitance @ Vds:
1260 pF @ 10 V
Length:
2mm
Pin Count:
6
Typical Turn-Off Delay Time:
37 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
1.9 W, 700 mW
Series:
PowerTrench
Maximum Gate Source Voltage:
-8 V, +8 V
Height:
0.75mm
Typical Turn-On Delay Time:
9 ns
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
32 mΩ
Detailed Description:
N-Channel 20V 9.4A (Ta) 1.9W (Ta) Surface Mount 6-MicroFET (2x2)
Vgs(th) (Max) @ Id:
1V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
6-WDFN Exposed Pad
Base Part Number:
FDMA76
Gate Charge (Qg) (Max) @ Vgs:
17.5nC @ 4.5V
Rds On (Max) @ Id, Vgs:
14.5mOhm @ 9.4A, 4.5V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
1.5V, 4.5V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
1680pF @ 10V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
6-MicroFET (2x2)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
9.4A (Ta)
Customer Reference:
Power Dissipation (Max):
1.9W (Ta)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDMA7628. It is of power mosfet category . The given dimensions of the product include 2 x 2 x 0.75mm. While 9 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 2mm wide. The product offers single transistor configuration. It has a maximum of 20 v drain source voltage. The package is a sort of mlp. It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 0.4v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 17.5 nc @ 4.5 v. The product is available in [Cannel Type] channel. Its typical input capacitance @ Vds is 1260 pf @ 10 v . Its accurate length is 2mm. It contains 6 pins. Whereas, its typical turn-off delay time is about 37 ns . The product is available in surface mount configuration. The product carries enhancement channel mode. Provides up to 1.9 w, 700 mw maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -8 v, +8 v. In addition, the height is 0.75mm. In addition, it has a typical 9 ns turn-on delay time . Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 32 mω maximum drain source resistance. It features n-channel 20v 9.4a (ta) 1.9w (ta) surface mount 6-microfet (2x2). The typical Vgs (th) (max) of the product is 1v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in 6-wdfn exposed pad. Base Part Number: fdma76. The maximum gate charge and given voltages include 17.5nc @ 4.5v. It has a maximum Rds On and voltage of 14.5mohm @ 9.4a, 4.5v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 1.5v, 4.5v. The on semiconductor's product offers user-desired applications. The product has a 20v drain to source voltage. The maximum Vgs rate is ±8v. The product's input capacitance at maximum includes 1680pf @ 10v. The product powertrench®, is a highly preferred choice for users. 6-microfet (2x2) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 9.4a (ta). The product carries maximum power dissipation 1.9w (ta). This product use mosfet (metal oxide) technology.

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Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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1Q2018 Product EOL 31/Mar/2018(PCN Obsolescence/ EOL)
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FDMA7628(Datasheets)
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Marking Content 19/Nov/2013(PCN Design/Specification)
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Design Change 03/Aug/2015(PCN Design/Specification)
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Mult Devices 29/Aug/2018(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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