ON Semiconductor FDD4141

FDD4141 ON Semiconductor
FDD4141
ON Semiconductor

Product Information

Maximum Continuous Drain Current:
10.8 A
Transistor Material:
Si
Width:
6.22mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
40 V
Package Type:
DPAK (TO-252)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
1V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
36 nC @ 10 V
Channel Type:
P
Length:
6.73mm
Pin Count:
3
Channel Mode:
Enhancement
Mounting Type:
Surface Mount
Maximum Power Dissipation:
69 W
Series:
PowerTrench
Maximum Gate Source Voltage:
-20 V, +20 V
Height:
2.39mm
Minimum Operating Temperature:
-55 °C
Maximum Drain Source Resistance:
18.7 mΩ
Manufacturer Standard Lead Time:
43 Weeks
Detailed Description:
P-Channel 40V 10.8A (Ta), 50A (Tc) 2.4W (Ta), 69W (Tc) Surface Mount D-PAK (TO-252AA)
Vgs(th) (Max) @ Id:
3V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-252-3, DPak (2 Leads + Tab), SC-63
Base Part Number:
FDD414
Gate Charge (Qg) (Max) @ Vgs:
50nC @ 10V
Rds On (Max) @ Id, Vgs:
12.3mOhm @ 12.7A, 10V
FET Type:
P-Channel
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
40V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
2775pF @ 20V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
D-PAK (TO-252AA)
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
10.8A (Ta), 50A (Tc)
Customer Reference:
Power Dissipation (Max):
2.4W (Ta), 69W (Tc)
Technology:
MOSFET (Metal Oxide)
RoHs Compliant
Checking for live stock

This is manufactured by ON Semiconductor. The manufacturer part number is FDD4141. While 10.8 a of maximum continuous drain current. The transistor is manufactured from highly durable si material. Furthermore, the product is 6.22mm wide. The product offers single transistor configuration. It has a maximum of 40 v drain source voltage. The package is a sort of dpak (to-252). It consists of 1 elements per chip. Whereas its minimum gate threshold voltage includes 1v. It has a maximum operating temperature of +150 °c. With a typical gate charge at Vgs includes 36 nc @ 10 v. The product is available in [Cannel Type] channel. Its accurate length is 6.73mm. It contains 3 pins. The product carries enhancement channel mode. The product is available in surface mount configuration. Provides up to 69 w maximum power dissipation. The product powertrench, is a highly preferred choice for users. It features a maximum gate source voltage of -20 v, +20 v. In addition, the height is 2.39mm. Whereas, the minimum operating temperature of the product is -55 °c. It provides up to 18.7 mω maximum drain source resistance. It has typical 43 weeks of manufacturer standard lead time. It features p-channel 40v 10.8a (ta), 50a (tc) 2.4w (ta), 69w (tc) surface mount d-pak (to-252aa). The typical Vgs (th) (max) of the product is 3v @ 250µa. The product has -55°c ~ 150°c (tj) operating temperature range. Moreover, the product comes in to-252-3, dpak (2 leads + tab), sc-63. Base Part Number: fdd414. The maximum gate charge and given voltages include 50nc @ 10v. It has a maximum Rds On and voltage of 12.3mohm @ 12.7a, 10v. It carries FET type p-channel. The drive voltage (maximum and minimum Rds On) of the product includes 4.5v, 10v. The on semiconductor's product offers user-desired applications. The product has a 40v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 2775pf @ 20v. The product powertrench®, is a highly preferred choice for users. d-pak (to-252aa) is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 10.8a (ta), 50a (tc). The product carries maximum power dissipation 2.4w (ta), 69w (tc). This product use mosfet (metal oxide) technology.

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Datasheet(Technical Reference)
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ESD Control Selection Guide V1(Technical Reference)
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Mult Dev 13/Aug/2020(PCN Assembly/Origin)
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FDD4141(Datasheets)
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Description Chg 01/Apr/2016(PCN Design/Specification)
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Logo 17/Aug/2017(PCN Design/Specification)
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Dpak Pkg 01/Apr/2008(PCN Packaging)
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Mult Devices 24/Oct/2017(PCN Packaging)

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