ON Semiconductor FDBL0090N40

FDBL0090N40 ON Semiconductor
ON Semiconductor

Product Information

Detailed Description:
N-Channel 40V 240A (Tc) 357W (Tj) Surface Mount 8-HPSOF
Vgs(th) (Max) @ Id:
4V @ 250µA
Operating Temperature:
-55°C ~ 175°C (TJ)
Package / Case:
8-PowerSFN
Base Part Number:
FDBL009
Gate Charge (Qg) (Max) @ Vgs:
188nC @ 10V
Rds On (Max) @ Id, Vgs:
0.9mOhm @ 80A, 10V
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
40V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
12000pF @ 25V
Mounting Type:
Surface Mount
Series:
PowerTrench®
Supplier Device Package:
8-HPSOF
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
240A (Tc)
Customer Reference:
Power Dissipation (Max):
357W (Tj)
Technology:
MOSFET (Metal Oxide)
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This is manufactured by ON Semiconductor. The manufacturer part number is FDBL0090N40. It features n-channel 40v 240a (tc) 357w (tj) surface mount 8-hpsof. The typical Vgs (th) (max) of the product is 4v @ 250µa. The product has -55°c ~ 175°c (tj) operating temperature range. Moreover, the product comes in 8-powersfn. Base Part Number: fdbl009. The maximum gate charge and given voltages include 188nc @ 10v. It has a maximum Rds On and voltage of 0.9mohm @ 80a, 10v. It carries FET type n-channel. The drive voltage (maximum and minimum Rds On) of the product includes 10v. The on semiconductor's product offers user-desired applications. The product has a 40v drain to source voltage. The maximum Vgs rate is ±20v. The product's input capacitance at maximum includes 12000pf @ 25v. The product is available in surface mount configuration. The product powertrench®, is a highly preferred choice for users. 8-hpsof is the supplier device package value. In addition, cut tape (ct) is the available packaging type of the product. The continuous current drain at 25°C is 240a (tc). The product carries maximum power dissipation 357w (tj). This product use mosfet (metal oxide) technology.

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FDBL0090N40(Datasheets)
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Logo 17/Aug/2017(PCN Design/Specification)
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Mult Devices 24/Oct/2017(PCN Packaging)

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