Category:
Power MOSFET
Dimensions:
9.35 x 10.4 x 4.6mm
Maximum Continuous Drain Current:
28 A
Transistor Material:
Si
Width:
10.4mm
Transistor Configuration:
Single
Maximum Drain Source Voltage:
600 V
Maximum Gate Threshold Voltage:
5V
Maximum Drain Source Resistance:
110 mΩ
Package Type:
D2PAK (TO-263)
Number of Elements per Chip:
1
Minimum Gate Threshold Voltage:
3V
Maximum Operating Temperature:
+150 °C
Typical Gate Charge @ Vgs:
54 nC @ 10 V
Channel Type:
N
Typical Input Capacitance @ Vds:
2400 pF @ 100 V
Length:
9.35mm
Pin Count:
3
Typical Turn-Off Delay Time:
68 ns
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
210 W
Series:
MDmesh DM2
Maximum Gate Source Voltage:
-25 V, +25 V
Height:
4.6mm
Typical Turn-On Delay Time:
21.2 ns
Minimum Operating Temperature:
-55 °C
Forward Diode Voltage:
1.6V
FET Feature:
-
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Rds On (Max) @ Id, Vgs:
110mOhm @ 14A, 10V
Gate Charge (Qg) (Max) @ Vgs:
54 nC @ 10 V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Unaffected
edacadModel:
STB35N60DM2 Models
FET Type:
N-Channel
Drive Voltage (Max Rds On, Min Rds On):
10V
edacadModelUrl:
/en/models/5866617
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
600 V
Vgs (Max):
±25V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Power Dissipation (Max):
210W (Tc)
Input Capacitance (Ciss) (Max) @ Vds:
2400 pF @ 100 V
standardLeadTime:
26 Weeks
Mounting Type:
Surface Mount
Series:
MDmesh™ DM2
Supplier Device Package:
D²PAK (TO-263)
Current - Continuous Drain (Id) @ 25°C:
28A (Tc)
Technology:
MOSFET (Metal Oxide)
Base Product Number:
STB35
ECCN:
EAR99
