Microchip Technology DN2540N3-G-P003

DN2540N3-G-P003 Microchip Technology
Microchip Technology

Product Information

FET Feature:
Depletion Mode
Base Part Number:
DN2540
Detailed Description:
N-Channel 400V 120mA (Tj) 1W (Tc) Through Hole TO-92 (TO-226)
Input Capacitance (Ciss) (Max) @ Vds:
300pF @ 25V
Mounting Type:
Through Hole
Rds On (Max) @ Id, Vgs:
25Ohm @ 120mA, 0V
Drain to Source Voltage (Vdss):
400V
Vgs (Max):
±20V
Drive Voltage (Max Rds On, Min Rds On):
0V
Supplier Device Package:
TO-92 (TO-226)
Manufacturer Standard Lead Time:
42 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
N-Channel
Customer Reference:
Package / Case:
TO-226-3, TO-92-3 (TO-226AA)
Power Dissipation (Max):
1W (Tc)
Current - Continuous Drain (Id) @ 25°C:
120mA (Tj)
Technology:
MOSFET (Metal Oxide)
Manufacturer:
Microchip Technology
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This is manufactured by Microchip Technology. The manufacturer part number is DN2540N3-G-P003. The FET features of the product include depletion mode. Base Part Number: dn2540. It features n-channel 400v 120ma (tj) 1w (tc) through hole to-92 (to-226). The product's input capacitance at maximum includes 300pf @ 25v. The product is available in through hole configuration. It has a maximum Rds On and voltage of 25ohm @ 120ma, 0v. The product has a 400v drain to source voltage. The maximum Vgs rate is ±20v. The drive voltage (maximum and minimum Rds On) of the product includes 0v. to-92 (to-226) is the supplier device package value. It has typical 42 weeks of manufacturer standard lead time. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type n-channel. Moreover, the product comes in to-226-3, to-92-3 (to-226aa). The product carries maximum power dissipation 1w (tc). The continuous current drain at 25°C is 120ma (tj). This product use mosfet (metal oxide) technology. The microchip technology's product offers user-desired applications.

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Assembly Site Add 8/Jun/2016(PCN Assembly/Origin)
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Packing Material 11/Oct/2019(PCN Packaging)
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Packing Changes 10/Oct/2016(PCN Packaging)

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