Maximum Drain Source Voltage:
20 V
Typical Gate Charge @ Vgs:
25 nC @ 4.5 V dc
Mounting Type:
Surface Mount
Channel Mode:
Enhancement
Maximum Power Dissipation:
2.5 W
Maximum Gate Source Voltage:
-8 V, +8 V
Maximum Gate Threshold Voltage:
1.5V
Height:
1.1mm
Width:
1.7mm
Length:
3.1mm
Maximum Drain Source Resistance:
52 mΩ
Package Type:
ChipFET
Number of Elements per Chip:
1
Minimum Operating Temperature:
-55 °C
Maximum Continuous Drain Current:
6.7 A
Transistor Material:
Si
Channel Type:
P
Maximum Operating Temperature:
+150 °C
Pin Count:
8
Transistor Configuration:
Single
Manufacturer Standard Lead Time:
36 Weeks
Detailed Description:
P-Channel 20V 4.8A (Tj) 1.3W (Ta) Surface Mount ChipFET™
Vgs(th) (Max) @ Id:
1.5V @ 250µA
Operating Temperature:
-55°C ~ 150°C (TJ)
Package / Case:
8-SMD, Flat Lead
Base Part Number:
NTHS41
Gate Charge (Qg) (Max) @ Vgs:
35nC @ 4.5V
Rds On (Max) @ Id, Vgs:
34mOhm @ 4.8A, 4.5V
FET Type:
P-Channel
Manufacturer:
ON Semiconductor
Drain to Source Voltage (Vdss):
20V
Vgs (Max):
±8V
Input Capacitance (Ciss) (Max) @ Vds:
2100pF @ 16V
Mounting Type:
Surface Mount
Supplier Device Package:
ChipFET™
Drive Voltage (Max Rds On, Min Rds On):
1.8V, 4.5V
Packaging:
Cut Tape (CT)
Current - Continuous Drain (Id) @ 25°C:
4.8A (Tj)
Customer Reference:
Power Dissipation (Max):
1.3W (Ta)
Technology:
MOSFET (Metal Oxide)
