Renesas Electronics America Inc UPA1890GR-9JG-E1-A

UPA1890GR-9JG-E1-A Renesas Electronics America Inc
Renesas Electronics America Inc

Product Information

FET Feature:
Logic Level Gate
HTSUS:
8541.29.0095
Vgs(th) (Max) @ Id:
2.5V @ 1mA
Package / Case:
8-SOIC (0.173", 4.40mm Width)
Rds On (Max) @ Id, Vgs:
27mOhm @ 3A, 10V
Gate Charge (Qg) (Max) @ Vgs:
14nC @ 10V
RoHS Status:
ROHS3 Compliant
REACH Status:
REACH Affected
Current - Continuous Drain (Id) @ 25°C:
6A, 5A
Configuration:
N and P-Channel
Package:
Tape & Reel (TR)
Drain to Source Voltage (Vdss):
30V
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Input Capacitance (Ciss) (Max) @ Vds:
748pF @ 10V
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-PSOP
Power - Max:
2W
Technology:
MOSFET (Metal Oxide)
Base Product Number:
UPA1890
ECCN:
EAR99
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This is manufactured by Renesas Electronics America Inc. The manufacturer part number is UPA1890GR-9JG-E1-A. The FET features of the product include logic level gate. It is assigned with possible HTSUS value of 8541.29.0095. The typical Vgs (th) (max) of the product is 2.5v @ 1ma. Moreover, the product comes in 8-soic (0.173", 4.40mm width). It has a maximum Rds On and voltage of 27mohm @ 3a, 10v. The maximum gate charge and given voltages include 14nc @ 10v. The product is rohs3 compliant. In addition, it is reach affected. The continuous current drain at 25°C is 6a, 5a. The product is available in n and p-channel configuration. It is shipped in tape & reel (tr) package . The product has a 30v drain to source voltage. Its typical moisture sensitivity level is 1 (unlimited). The product's input capacitance at maximum includes 748pf @ 10v. The product is available in surface mount configuration. 8-psop is the supplier device package value. The maximum power of the product is 2w. This product use mosfet (metal oxide) technology. Moreover, it corresponds to upa1890, a base product number of the product. The product is designated with the ear99 code number.

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Multiple Devices 28/Aug/2013(PCN Obsolescence/ EOL)
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Wafer Fabrication Site Change 10/Oct/2013(PCN Assembly/Origin)
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Label Change-All Devices 01/Dec/2022(PCN Packaging)

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