Texas Instruments CSD86350Q5D

CSD86350Q5D Texas Instruments
CSD86350Q5D
CSD86350Q5D
Texas Instruments

Product Information

FET Feature:
Logic Level Gate
Base Part Number:
CSD86350Q5
Detailed Description:
Mosfet Array 2 N-Channel (Half Bridge) 25V 40A 13W Surface Mount 8-LSON (5x6)
Input Capacitance (Ciss) (Max) @ Vds:
1870pF @ 12.5V
Gate Charge (Qg) (Max) @ Vgs:
10.7nC @ 4.5V
Mounting Type:
Surface Mount
Vgs(th) (Max) @ Id:
2.1V @ 250µA
Series:
NexFET™
Package / Case:
8-PowerLDFN
Rds On (Max) @ Id, Vgs:
6mOhm @ 20A, 8V
Supplier Device Package:
8-LSON (5x6)
Manufacturer Standard Lead Time:
35 Weeks
Packaging:
Cut Tape (CT)
Operating Temperature:
-55°C ~ 150°C (TJ)
FET Type:
2 N-Channel (Half Bridge)
Customer Reference:
Power - Max:
13W
Drain to Source Voltage (Vdss):
25V
Current - Continuous Drain (Id) @ 25°C:
40A
Manufacturer:
Texas Instruments
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This is manufactured by Texas Instruments. The manufacturer part number is CSD86350Q5D. The FET features of the product include logic level gate. Base Part Number: csd86350q5. It features mosfet array 2 n-channel (half bridge) 25v 40a 13w surface mount 8-lson (5x6). The product's input capacitance at maximum includes 1870pf @ 12.5v. The maximum gate charge and given voltages include 10.7nc @ 4.5v. The product is available in surface mount configuration. The typical Vgs (th) (max) of the product is 2.1v @ 250µa. The product nexfet™, is a highly preferred choice for users. Moreover, the product comes in 8-powerldfn. It has a maximum Rds On and voltage of 6mohm @ 20a, 8v. 8-lson (5x6) is the supplier device package value. It has typical 35 weeks of manufacturer standard lead time. In addition, cut tape (ct) is the available packaging type of the product. The product has -55°c ~ 150°c (tj) operating temperature range. It carries FET type 2 n-channel (half bridge). The maximum power of the product is 13w. The product has a 25v drain to source voltage. The continuous current drain at 25°C is 40a. The texas instruments's product offers user-desired applications.

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Qualification Wire Bond 27/May/2014(PCN Assembly/Origin)
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Qualification Revision A 01/Jul/2014(PCN Design/Specification)
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MSL1 Bubble Bag Conversion 24/Sep/2013(PCN Packaging)

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