NXP USA Inc. BFM505,115

BFM505-115 NXP USA Inc. BFM505,115
NXP USA Inc.

Product Information

Current - Collector (Ic) (Max):
18mA
HTSUS:
8541.21.0095
RoHS Status:
ROHS3 Compliant
Voltage - Collector Emitter Breakdown (Max):
8V
Operating Temperature:
175°C (TJ)
Package / Case:
6-TSSOP, SC-88, SOT-363
DC Current Gain (hFE) (Min) @ Ic, Vce:
60 @ 5mA, 6V
Noise Figure (dB Typ @ f):
1.1dB ~ 1.9dB @ 900MHz ~ 2GHz
Frequency - Transition:
9GHz
REACH Status:
REACH Unaffected
edacadModel:
BFM505,115 Models
Gain:
-
edacadModelUrl:
/en/models/1163862
Manufacturer:
NXP USA Inc.
Transistor Type:
2 NPN (Dual)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
6-TSSOP
Packaging:
Tape & Reel (TR)
Power - Max:
500mW
Base Product Number:
BFM50
ECCN:
EAR99
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This is manufactured by NXP USA Inc.. The manufacturer part number is BFM505,115. The maximum collector current includes 18ma. It is assigned with possible HTSUS value of 8541.21.0095. The product is rohs3 compliant. The maximum collector emitter breakdown voltage of the product is 8v. The product has 175°c (tj) operating temperature range. Moreover, the product comes in 6-tssop, sc-88, sot-363. Furthermore, 60 @ 5ma, 6v is the minimum DC current gain at given voltage. It has given noise figure of 1.1db ~ 1.9db @ 900mhz ~ 2ghz at given frequency. The transition frequency of the product is 9ghz. In addition, it is reach unaffected. The nxp usa inc.'s product offers user-desired applications. The transistor is a 2 npn (dual) type. Its typical moisture sensitivity level is 1 (unlimited). The product is available in surface mount configuration. 6-tssop is the supplier device package value. In addition, tape & reel (tr) is the available packaging type of the product. The maximum power of the product is 500mw. Moreover, it corresponds to bfm50, a base product number of the product. The product is designated with the ear99 code number.

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NXP USA Inc REACH(Environmental Information)
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NXP USA Inc RoHS Cert(Environmental Information)
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Resin Hardener 02/Jul/2013(PCN Design/Specification)
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Multiple Devices 29/Dec/2014(PCN Obsolescence/ EOL)
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BFM505(Datasheets)
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All Dev Label Update 15/Dec/2020(PCN Packaging)

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FAQs

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