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The SL-015-AL-15 is a high-performance thermal pad from Silfox designed to dissipate heat and prevent overheating in electronic devices efficiently. This pad features a ceramic aluminium oxide core, providing exceptional thermal conductivity and low thermal resistance. Its 1.5mm thickness offers a balance between effective heat transfer and a compact profile, making it suitable for various applications.
The pad's special features include its excellent thermal conductivity, broad operating temperature range, and long-term reliability. Potential benefits of using this thermal interface pad include improved device performance, reduced power consumption, and extended component lifespan.
The SL-015-AL-15 finds broad-range applications in various electronic devices, including:
For more information please check the datasheets.
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