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The Bergquist GPVOUS-0.020-AC-00-200X100 thermal interface sheet is a high-performance gap pad designed to provide superior thermal conductivity and protection in electronic assemblies. With its ultra-soft composition, this 0.02-inch-thick gap pad efficiently fills gaps between heat-generating components and heatsinks, ensuring optimal heat dissipation while minimising mechanical stress. Its 200 x 100mm size makes it suitable for a variety of industrial, automotive, and power electronics applications, delivering enhanced thermal management and long-term reliability.
This high-quality thermal interface sheet is engineered to improve heat dissipation efficiency, ensuring that electronic components operate at safe temperatures. Its ultra-soft formulation allows it to adapt to uneven surfaces, providing a more effective thermal transfer than rigid thermal pads. With electrical insulation properties, it also enhances device safety by lessening the risk of short circuits.
This Bergquist thermal interface sheet is the ideal thermal gap filler for engineers looking to maximise heat dissipation in power electronics, industrial machinery, and high-performance computing. With its ultra-soft material, high thermal conductivity, and electrical insulation, this thermal pad ensures enhanced device safety and efficiency.
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