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The Bergquist GPVOUS-0.040-00-0816 is a high-performance, pink-coloured interface material designed for efficient heat transfer between electronic components and heat sinks or enclosures. Measuring 406.40mm x 203.20mm in a rectangular shape, this thermal pad features a unique tacky surface on one side, ensuring a secure attachment and enhancing thermal conductivity. The material's specialised composition allows it to conform to uneven surfaces, filling air gaps and voids that can hinder thermal performance. This thermal pad serves as a critical component in managing the thermal profiles of various electronic systems, ensuring they operate within safe temperature ranges and maintain performance integrity.
The thermal pad's composition is engineered to facilitate efficient heat dissipation, reducing the operational temperatures of electronic components and extending their lifespan.
The Bergquist GPVOUS-0.040-00-0816 thermal pad finds its utility in a diverse array of applications within the electronics industry. Its design and thermal properties make it particularly suitable for:
For more information please check the datasheets.
Wire splice connectors made joining cables so much easier and safer. Very secure connection.
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