Microchip Technology MCP98243T-BE/MNY

MCP98243T-BE-MNY Microchip Technology MCP98243T-BE/MNY
Microchip Technology

Product Information

HTSUS:
8542.39.0001
RoHS Status:
ROHS3 Compliant
Operating Temperature:
-40°C ~ 125°C
Package / Case:
8-WFDFN Exposed Pad
Accuracy:
±3°C(Max)
Function:
Temp Monitoring System (Sensor), DIMM DDR Memory
Sensor Type:
Internal
REACH Status:
REACH Unaffected
Output Type:
I2C/SMBus
edacadModel:
MCP98243T-BE/MNY Models
Output Fan:
No
edacadModelUrl:
/en/models/2077158
Topology:
ADC (Sigma Delta), Register Bank
Package:
Tape & Reel (TR)
Moisture Sensitivity Level (MSL):
1 (Unlimited)
Output Alarm:
Yes
standardLeadTime:
7 Weeks
Sensing Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Series:
-
Supplier Device Package:
8-TDFN (2x3)
Voltage - Supply:
2.7V ~ 5.5V
Base Product Number:
MCP98243
ECCN:
EAR99
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This is manufactured by Microchip Technology. The manufacturer part number is MCP98243T-BE/MNY. It is assigned with possible HTSUS value of 8542.39.0001. The product is rohs3 compliant. The product has -40°c ~ 125°c operating temperature range. Moreover, the product comes in 8-wfdfn exposed pad. It provides high accuracy of ±3°c(max). It performs basic function of temp monitoring system (sensor), dimm ddr memory. These sensors are sort of internal. In addition, it is reach unaffected. Furthermore, it has ai2c/smbus output. Output Fan Option - no. Topology includes adc (sigma delta), register bank. It is shipped in tape & reel (tr) package . Its typical moisture sensitivity level is 1 (unlimited). Output Alarm Option - yes. It has a long 7 weeks standard lead time. It offers -40°c ~ 125°c of sensing temperature. The product is available in surface mount configuration. 8-tdfn (2x3) is the supplier device package value. It has optimum voltage supply of 2.7v ~ 5.5v. Moreover, it corresponds to mcp98243, a base product number of the product. The product is designated with the ear99 code number.

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Microchip CA Prop65(Environmental Information)
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Microchip RoHS(Environmental Information)
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Microchip REACH(Environmental Information)
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Additional Assembly Site 13/Apr/2021(PCN Assembly/Origin)
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8L TDFN Package 09/Oct/2016(PCN Design/Specification)
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Mold Compound Update 18/Feb/2015(PCN Design/Specification)
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CuPdAu Bond Wire 24/Apr/2015(PCN Other)
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MCP98243(Datasheets)
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Analog and Interface Product Guide(Datasheets)
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Packing Changes 10/Oct/2016(PCN Packaging)
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Label and Packing Changes 23/Sep/2015(PCN Packaging)

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FAQs

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